Knowledge Management System of Institue of Mechanics, CAS
| Innovative Fluorinated Polyimides with Superior Thermal, Mechanical, and Dielectric Properties for Advanced Soft Electronics | |
| Chen YW(陈钰玮)1; Liu YD(刘屹东)2,3; Min, Yonggang1 | |
| Corresponding Author | Liu, Yidong([email protected]) ; Min, Yonggang([email protected]) |
| Source Publication | POLYMERS
 |
| 2025-02-01 | |
| Volume | 17Issue:3Pages:12 |
| Abstract | This study addresses the limitations of traditional polyimides (PIs) in high-frequency and high-temperature soft electronic applications, and then introducing trifluoromethylbenzene (TFMB) into the molecular structure and employing various diamines as connecting components to solve the bottleneck. The innovative molecular design enhances thermal, mechanical, and dielectric properties, overcoming challenges in balancing these performances. The optimized fluorinated PI (TPPI50) exhibits exceptional properties, including a glass transition temperature of 402 degrees C, thermal decomposition temperature of 563 degrees C, tensile strength of 232.73 MPa, elongation at break of 26.26%, and dielectric constant of 2.312 at 1 MHz with a dielectric loss as low as 0.00676. These improvements are attributed to the unique synergy between TFMB's fluorinated groups, which reduce molecular polarization, and the biphenyl structure, which reinforces chain stability. Compared to conventional PIs, TPPI50 demonstrates superior comprehensive performance, making it highly suitable for soft circuits, high-frequency signal transmission, and advanced applications such as wearable devices and biosensors. This study provides a robust framework for industrial applications, offering a path to next-generation soft electronics with enhanced reliability and performance. |
| Keyword | fluorinated polyimide low dielectric constant molecular dynamics DFT |
| DOI | 10.3390/polym17030339 |
| Indexed By | SCI ; EI |
| Language | 英语 |
| WOS ID | WOS:001418395600001 |
| WOS Keyword | GAUSSIAN-BASIS SETS ; MOLECULAR CALCULATIONS ; ATOMS ; FILMS ; TRANSPARENT |
| WOS Research Area | Polymer Science |
| WOS Subject | Polymer Science |
| Funding Project | High-level Innovation Research Institute Program of Guangdong Province ; National Natural Science Foundation of China[U20A20340] ; Foshan Introducing Innovative and Entrepreneurial Teams[1920001000108] ; Strategic Priority Research Program of the Chinese Academy of Sciences[XDB0910303] ; [2020B0909010003/GARA2023001000] |
| Funding Organization | High-level Innovation Research Institute Program of Guangdong Province ; National Natural Science Foundation of China ; Foshan Introducing Innovative and Entrepreneurial Teams ; Strategic Priority Research Program of the Chinese Academy of Sciences |
| Classification | 二类/Q1 |
| Ranking | 1 |
| Contributor | 刘屹东 ; Min, Yonggang |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/100078 |
| Collection | 宽域飞行工程科学与应用中心 |
| Affiliation | 1.Guangdong Univ Technol, Sch Electromech Engn, Guangzhou HEMC, 100 Waihuanxi Rd, Guangzhou 510006, Peoples R China; 2.Chinese Acad Sci, Inst Mech, Widerange Flight Engn Sci & Applicat Ctr, 15 Beisihuanxi Rd, Beijing 100190, Peoples R China; 3.Guangdong Aerosp Res Acad, Guangzhou 511458, Peoples R China |
| Recommended Citation GB/T 7714 | Chen YW,Liu YD,Min, Yonggang. Innovative Fluorinated Polyimides with Superior Thermal, Mechanical, and Dielectric Properties for Advanced Soft Electronics[J]. POLYMERS,2025,17,3,:12.Rp_Au:刘屹东, Min, Yonggang |
| APA | 陈钰玮,刘屹东,&Min, Yonggang.(2025).Innovative Fluorinated Polyimides with Superior Thermal, Mechanical, and Dielectric Properties for Advanced Soft Electronics.POLYMERS,17(3),12. |
| MLA | 陈钰玮,et al."Innovative Fluorinated Polyimides with Superior Thermal, Mechanical, and Dielectric Properties for Advanced Soft Electronics".POLYMERS 17.3(2025):12. |
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