Knowledge Management System of Institue of Mechanics, CAS
Rapid sintering of alumina in low pressure RF plasma | |
Pan WX(潘文霞)![]() | |
Source Publication | Journal of University of Science and Technology Beijing
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1999 | |
Volume | 6Issue:2Pages:133-135 |
ISSN | 1005-8850 |
Abstract | Three kinds of high-purity Al2O3,, powders, whose average particle size is 0.1, 0.3 and 3.0 mu m respectively, were used as the starting power, and their compacts were fired in the radio-frequency plasma generated at a pressure of 80 Pa using N-2? as the working gas. Experimental results show that the 0.1 and 0.3 Irm powder compacts can be sintered to nearly the theoretical density within 60 s and this sintering is almost finished in the heating period. It is concluded that the mechanism of liquid sintering, the electric charge effect of Al2O3 powder, and the effect of temperature gradient in the compacts can affect simultaneously on the rapid densification of the compacts in the plasma sintering. |
Subject Area | 力学 |
Indexed By | SCI ; EI |
Language | 英语 |
WOS ID | WOS:000081618300013 |
WOS Research Area | Materials Science ; Metallurgy & Metallurgical Engineering ; Mining & Mineral Processing |
WOS Subject | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Mining & Mineral Processing |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/15377 |
Collection | 力学所知识产出(1956-2008) |
Corresponding Author | Pan, WX (reprint author), Chinese Acad Sci, Inst Mech, Beijing 100080, Peoples R China. |
Recommended Citation GB/T 7714 | Pan WX,Lv FX,Yoshida T,et al. Rapid sintering of alumina in low pressure RF plasma[J]. Journal of University of Science and Technology Beijing,1999,6,2,:133-135. |
APA | 潘文霞,吕反修,Yoshida T,&Pan, WX .(1999).Rapid sintering of alumina in low pressure RF plasma.Journal of University of Science and Technology Beijing,6(2),133-135. |
MLA | 潘文霞,et al."Rapid sintering of alumina in low pressure RF plasma".Journal of University of Science and Technology Beijing 6.2(1999):133-135. |
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