Knowledge Management System of Institue of Mechanics, CAS
| Flip Chip Technologies and Their Applications in MEMS Packaging | |
Wang HY(汪海英); Bai YL(白以龙) ; Wang, HY (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
| |
| Source Publication | International Journal of Nonlinear Sciences and Numerical Simulation
 |
| 2002 | |
| Volume | 3Issue:3-4Pages:433-436 |
| ISSN | 1565-1339 |
| Abstract | The high cost and undesirable bulky packages have been and continues to be major stumbling blocks in commercializing MEMS products. Flip chip technologies are very promising techniques for MEMS packaging. This paper presents a brief introduction of flip chip technologies as well as examples of successful applications of flip chip technologies in MEMS (e.g. RF and optical MEMS, micro sensors) packaging. The result shows that, although MEMS packaging is much more complicated than that for microelectronics, flip chip technologies can be applicable means of integrating MEMS devices. It is also shown that to meet different packaging requirements of various MEMS devices, bumping materials, bumping process and joining methods must be chosen carefully. Issues, such as package deformation, temperature distributions, heat sink placement, are all very crucial for the performance of MEMS devices and should be considered in MEMS packaging design. |
| Subject Area | 力学 |
| Indexed By | SCI |
| Language | 英语 |
| WOS ID | WOS:000176903800061 |
| WOS Research Area | Engineering ; Mathematics ; Mechanics ; Physics |
| WOS Subject | Engineering, Multidisciplinary ; Mathematics, Applied ; Mechanics ; Physics, Mathematical |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/15468 |
| Collection | 力学所知识产出(1956-2008) |
| Corresponding Author | Wang, HY (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China. |
| Recommended Citation GB/T 7714 | Wang HY,Bai YL,Wang, HY . Flip Chip Technologies and Their Applications in MEMS Packaging[J]. International Journal of Nonlinear Sciences and Numerical Simulation,2002,3,3-4,:433-436. |
| APA | Wang HY,Bai YL,&Wang, HY .(2002).Flip Chip Technologies and Their Applications in MEMS Packaging.International Journal of Nonlinear Sciences and Numerical Simulation,3(3-4),433-436. |
| MLA | Wang HY,et al."Flip Chip Technologies and Their Applications in MEMS Packaging".International Journal of Nonlinear Sciences and Numerical Simulation 3.3-4(2002):433-436. |
| Files in This Item: | Download All | |||||
| File Name/Size | DocType | Version | Access | License | ||
| ja347.pdf（752KB） | 开放获取 | -- | View Download | |||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment