Knowledge Management System of Institue of Mechanics, CAS
Mechanics of Adhesion in MEMS-a Review | |
Zhao YP(赵亚溥)![]() ![]() | |
Source Publication | Journal of Adhesion Science and Technology
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2003 | |
Volume | 17Issue:4Pages:519-546 |
ISSN | 0169-4243 |
Abstract | A review is presented of the mechanics of microscale adhesion in microelectromechanical systems (MEMS). Some governing dimensionless numbers such as Tabor number, adhesion parameter and peel number for microscale elastic adhesion contact are discussed in detail. The peel number is modified for the elastic contact between a rough surface in contact with a smooth plane. Roughness ratio is introduced to characterize the relative importance of surface roughness for microscale adhesion contact, and three kinds of asperity height distributions are discussed: Gaussian, fractal, and exponential distributions. Both Gaussian and exponential distributions are found to be special cases of fractal distribution. Casimir force induced adhesion in MEMS, and adhesion of carbon nanotubes to a substrate are also discussed. Finally, microscale plastic adhesion contact theory is briefly reviewed, and it is found that the dimensionless number, plasticity index of various forms, can be expressed by the roughness ratio. |
Subject Area | 力学 |
DOI | 10.1163/15685610360554393 |
Indexed By | SCI |
Language | 英语 |
WOS ID | WOS:000182207800003 |
WOS Research Area | Engineering ; Materials Science ; Mechanics |
WOS Subject | Engineering, Chemical ; Materials Science, Multidisciplinary ; Mechanics |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/16272 |
Collection | 力学所知识产出(1956-2008) |
Recommended Citation GB/T 7714 | Zhao YP,Wang LS,Yu TX. Mechanics of Adhesion in MEMS-a Review[J]. Journal of Adhesion Science and Technology,2003,17,4,:519-546. |
APA | 赵亚溥,王立森,&余同希.(2003).Mechanics of Adhesion in MEMS-a Review.Journal of Adhesion Science and Technology,17(4),519-546. |
MLA | 赵亚溥,et al."Mechanics of Adhesion in MEMS-a Review".Journal of Adhesion Science and Technology 17.4(2003):519-546. |
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