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| Cu原子簇触发形核下的深过冷Ag-Ge合金组织演变研究 | |
| Alternative Title | Microstructural evolution of the deeply undercooled Ag-Ge alloys with Cu atoms cluster triggered nucleation |
孙玉峰 ; 刘晓芳; 王育人; 魏炳忱
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| Source Publication | 稀有金属材料与工程=Rare Metal Materials and Engineering
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| 2006 | |
| Volume | 35Issue:5Pages:732-735 |
| ISSN | 1002-185X |
| Abstract | 采用玻璃包覆的方法获得具有较大过冷度的亚共晶、共晶以及过共晶Ag-Ge合金熔体,并通过高能离子束轰击Cu箔产生Cu原子团簇溅射到过冷合金熔体中来触发非均质形核过程.凝固后合金显微组织的分析结果表明:在深过冷合金熔体中引入Cu原子团簇,它对亚共晶、共晶以及过共晶Ag-Ge合金的显微组织演变有着不同的影响效果,分析了显微组织的演变规律与形成机制. The Ag-Ge alloy melts with deeply undercooled hypoeutectic, eutectic and hypereutectic were obtained via glass fluxing technique. The nucleation of the deeply undercooled alloy melts were triggered by atoms cluster sputtering on the surface of the melts. The atoms clusters were generated by an ion beam bombarding on the Cu foil fixed above the alloy melts. The resultant microstructure reveals that the induced atom clusters exert great influence on the microstructural evolution of the highly undercooled eutectic and hypereutectic Ag-Ge alloys, but no obvious influence on the highly undercooled hypoeutectic alloy. The microstructural evolution and formation mechanism were analyzed and discussed. |
| Subject Area | 力学 |
| Indexed By | SCI ; EI ; CSCD |
| Language | 中文 |
| WOS ID | WOS:000238275000015 |
| WOS Research Area | Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS Subject | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| CSCD ID | CSCD:2505102 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/16675 |
| Collection | 力学所知识产出(1956-2008) |
| Recommended Citation GB/T 7714 | 孙玉峰,刘晓芳,王育人,等. Cu原子簇触发形核下的深过冷Ag-Ge合金组织演变研究[J]. 稀有金属材料与工程=Rare Metal Materials and Engineering,2006,35,5,:732-735. |
| APA | 孙玉峰,刘晓芳,王育人,&魏炳忱.(2006).Cu原子簇触发形核下的深过冷Ag-Ge合金组织演变研究.稀有金属材料与工程=Rare Metal Materials and Engineering,35(5),732-735. |
| MLA | 孙玉峰,et al."Cu原子簇触发形核下的深过冷Ag-Ge合金组织演变研究".稀有金属材料与工程=Rare Metal Materials and Engineering 35.5(2006):732-735. |
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