Knowledge Management System of Institue of Mechanics, CAS
Microscale mechanics for metal thin film delamination along ceramic substrates | |
Wei YG(魏悦广)![]() | |
Source Publication | Science in China Series A-Mathematics Physics Astronomy
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2000 | |
Volume | 43Issue:5Pages:509-516 |
ISSN | 1006-9283 |
Abstract | The metal thin film delamination along metal/ceramic interface in the case of large scale yielding is studied by employing the strain gradient plasticity theory and the material microscale effects are considered. Two different fracture process models are used in this study to describe the nonlinear delamination phenomena for metal thin films. A set of experiments have been done on the mechanism of copper films delaminating from silica substrates, based on which the peak interface separation stress and the micro-length scale of material, as well as the dislocation-free zone size are predicted. |
Subject Area | 力学 |
DOI | 10.1007/BF02897142 |
Indexed By | SCI |
Language | 英语 |
WOS ID | WOS:000088249100006 |
WOS Keyword | STRAIN GRADIENT PLASTICITY ; CRACK-GROWTH ; TOUGHNESS ; FRACTURE ; SOLIDS ; MODEL |
WOS Research Area | Mathematics |
WOS Subject | Mathematics, Applied ; Mathematics |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/17105 |
Collection | 力学所知识产出(1956-2008) |
Corresponding Author | Wei, YQ (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China. |
Recommended Citation GB/T 7714 | Wei YG,Wei, YQ . Microscale mechanics for metal thin film delamination along ceramic substrates[J]. Science in China Series A-Mathematics Physics Astronomy,2000,43,5,:509-516. |
APA | 魏悦广,&Wei, YQ .(2000).Microscale mechanics for metal thin film delamination along ceramic substrates.Science in China Series A-Mathematics Physics Astronomy,43(5),509-516. |
MLA | 魏悦广,et al."Microscale mechanics for metal thin film delamination along ceramic substrates".Science in China Series A-Mathematics Physics Astronomy 43.5(2000):509-516. |
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