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Microscale mechanics for metal thin film delamination along ceramic substrates
Wei YG(魏悦广); Wei, YQ (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
Source PublicationScience in China Series A-Mathematics Physics Astronomy
2000
Volume43Issue:5Pages:509-516
ISSN1006-9283
AbstractThe metal thin film delamination along metal/ceramic interface in the case of large scale yielding is studied by employing the strain gradient plasticity theory and the material microscale effects are considered. Two different fracture process models are used in this study to describe the nonlinear delamination phenomena for metal thin films. A set of experiments have been done on the mechanism of copper films delaminating from silica substrates, based on which the peak interface separation stress and the micro-length scale of material, as well as the dislocation-free zone size are predicted.
Subject Area力学
DOI10.1007/BF02897142
Indexed BySCI
Language英语
WOS IDWOS:000088249100006
WOS KeywordSTRAIN GRADIENT PLASTICITY ; CRACK-GROWTH ; TOUGHNESS ; FRACTURE ; SOLIDS ; MODEL
WOS Research AreaMathematics
WOS SubjectMathematics, Applied ; Mathematics
Citation statistics
Cited Times:4[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/17105
Collection力学所知识产出(1956-2008)
Corresponding AuthorWei, YQ (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
Recommended Citation
GB/T 7714
Wei YG,Wei, YQ . Microscale mechanics for metal thin film delamination along ceramic substrates[J]. Science in China Series A-Mathematics Physics Astronomy,2000,43,5,:509-516.
APA 魏悦广,&Wei, YQ .(2000).Microscale mechanics for metal thin film delamination along ceramic substrates.Science in China Series A-Mathematics Physics Astronomy,43(5),509-516.
MLA 魏悦广,et al."Microscale mechanics for metal thin film delamination along ceramic substrates".Science in China Series A-Mathematics Physics Astronomy 43.5(2000):509-516.
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