Knowledge Management System of Institue of Mechanics, CAS
| Assessment of Microscale Test Methods of Peeling and Splitting along Surface of Thin-Film/Substrates | |
Wei YG(魏悦广)
| |
| Source Publication | Materials Research Society Symposium Proceedings |
| 2002 | |
| Pages | 305-310 |
| Conference Name | SURFACE ENGINEERING 2001 - FUNDAMENTALS AND APPLICATIONS |
| Conference Date | 2001 |
| Abstract | Peel test methods are assessed through being applied to a peeling analysis of the ductile film/ceramic substrate system. Through computing the fracture work of the system using the either beam bend model (BB model) or the general plane analysis model (GPA model), surprisingly, a big difference between both model results is found. Although the BB model can capture the plastic dissipation phenomenon for the ductile film case as the GPA model can, it is much sensitive to the choice of the peeling criterion parameters, and it overestimates the plastic bending effect unable to capture crack tip constraint plasticity. In view of the difficulty of measuring interfacial toughness using peel test method when film is the ductile material, a new test method, split test, is recommended and analyzed using the GPA model. The prediction is applied to a wedge-loaded experiment for Al-alloy double-cantilever beam in literature. |
| WOS ID | WOS:000178303600045 |
| ISBN | 1-55899-633-8 |
| URL | 查看原文 |
| Indexed By | CPCI-S ; EI |
| Language | 英语 |
| Citation statistics | |
| Document Type | 会议论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/17176 |
| Collection | 力学所知识产出(1956-2008) |
| Recommended Citation GB/T 7714 | Wei YG. Assessment of Microscale Test Methods of Peeling and Splitting along Surface of Thin-Film/Substrates[C]Materials Research Society Symposium Proceedings,2002:305-310. |
| Files in This Item: | Download All | |||||
| File Name/Size | DocType | Version | Access | License | ||
| ja320.pdf（139KB） | 会议论文 | 开放获取 | CC BY-NC-SA | View Download | ||
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