Knowledge Management System of Institue of Mechanics, CAS
Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon | |
Tang QH(汤奇恒)![]() | |
Source Publication | Materials Science In Semiconductor Processing
![]() |
2007 | |
Pages | 270-275 |
ISSN | 1369-8001 |
Abstract | By means of Tersoff and Morse potentials, a three-dimensional molecular dynamics simulation is performed to study atomic force microscopy cutting on silicon monocrystal surface. The interatomic forces between the workpiece and the pin tool and the atoms of workpiece themselves are simulated. Two partial edge dislocations are introduced into workpiece Si, it is found that the motion of dislocations does not occur during the atomic force microscopy cutting processing. Simulation results show that the shear stress acting on dislocations is far below the yield strength of Si. (c) 2008 Elsevier Ltd. All rights reserved. |
Keyword | Molecular Dynamics Simulation Atomic Force Microscopy Silicon Dislocation Pin Tool Atomic-force Microscopy Molecular-dynamics Simulation Phase-transformations Shuffle Dislocations Nano-indentation Monocrystals Surface Si Deformation Fracture |
DOI | 10.1016/j.mssp.2008.03.004 |
Indexed By | SCI ; EI |
Language | 英语 |
WOS ID | WOS:000257894800008 |
WOS Keyword | ATOMIC-FORCE MICROSCOPY ; MOLECULAR-DYNAMICS SIMULATION ; PHASE-TRANSFORMATIONS ; SHUFFLE DISLOCATIONS ; NANO-INDENTATION ; MONOCRYSTALS ; SURFACE ; SI ; DEFORMATION ; FRACTURE |
WOS Research Area | Engineering ; Materials Science ; Physics |
WOS Subject | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/25496 |
Collection | 力学所知识产出(1956-2008) |
Corresponding Author | Tang, QH (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China. |
Recommended Citation GB/T 7714 | Tang QH,Tang, QH . Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon[J]. Materials Science In Semiconductor Processing,2007:270-275. |
APA | 汤奇恒,&Tang, QH .(2007).Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon.Materials Science In Semiconductor Processing,270-275. |
MLA | 汤奇恒,et al."Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon".Materials Science In Semiconductor Processing (2007):270-275. |
Files in This Item: | Download All | |||||
File Name/Size | DocType | Version | Access | License | ||
J2007-02.pdf(1138KB) | 开放获取 | -- | View Download |
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment