Knowledge Management System of Institue of Mechanics, CAS
| Peeling Experiments Of Ductile Thin Films Along Ceramic Substrates - Critical Assessment Of Analytical Models | |
Wei YG(魏悦广) ; Zhao HF(赵海峰); Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
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| Source Publication | International Journal of Solids and Structures
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| 2008 | |
| Pages | 3779-3792 |
| ISSN | 0020-7683 |
| Abstract | Two types of peeling experiments are performed in the present research. One is for the Al film/Al2O3 substrate system with an adhesive layer between the film and the substrate. The other one is for the Cu film/Al2O3 substrate system without adhesive layer between the film and the substrate, and the Cu films are electroplated onto the Al2O3 substrates. For the case with adhesive layer, two kinds of adhesives are selected, which are all the mixtures of epoxy and polyimide with mass ratios 1:1.5 and 1:1, respectively. The relationships between energy release rate, the film thickness and the adhesive layer thickness are measured during the steady-state peeling process. The effects of the adhesive layer on the energy release rate are analyzed. Using the experimental results, several analytical criteria for the steady-state peeling based on the bending model and on the two-dimensional finite element analysis model are critically assessed. Through assessment of analytical models, we find that the cohesive zone criterion based on the beam bend model is suitable for a weak interface strength case and it describes a macroscale fracture process zone case, while the two-dimensional finite element model is effective to both the strong interface and weak interface, and it describes a small-scale fracture process zone case. (C) 2007 Elsevier Ltd. All rights reserved. |
| Keyword | Peel Experiment Metal Thin Film Analytical Model Interfacial Fracture Energy Pressure-sensitive Adhesive Strain Gradient Plasticity State Crack-growth Fracture Criterion Cantilever Beam Round-robin Work Toughness Strength Surface |
| DOI | 10.1016/j.ijsolstr.2007.10.023 |
| Indexed By | SCI ; EI |
| Language | 英语 |
| WOS ID | WOS:000256254800013 |
| WOS Keyword | PRESSURE-SENSITIVE ADHESIVE ; STRAIN GRADIENT PLASTICITY ; STATE CRACK-GROWTH ; FRACTURE CRITERION ; CANTILEVER BEAM ; ROUND-ROBIN ; WORK ; TOUGHNESS ; STRENGTH ; SURFACE |
| WOS Research Area | Mechanics |
| WOS Subject | Mechanics |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/26024 |
| Collection | 力学所知识产出(1956-2008) |
| Corresponding Author | Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China. |
| Recommended Citation GB/T 7714 | Wei YG,Zhao HF,Wei, YG . Peeling Experiments Of Ductile Thin Films Along Ceramic Substrates - Critical Assessment Of Analytical Models[J]. International Journal of Solids and Structures,2008:3779-3792. |
| APA | 魏悦广,赵海峰,&Wei, YG .(2008).Peeling Experiments Of Ductile Thin Films Along Ceramic Substrates - Critical Assessment Of Analytical Models.International Journal of Solids and Structures,3779-3792. |
| MLA | 魏悦广,et al."Peeling Experiments Of Ductile Thin Films Along Ceramic Substrates - Critical Assessment Of Analytical Models".International Journal of Solids and Structures (2008):3779-3792. |
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