| Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling | |
Wei JJ(魏进家); Zhao JF(赵建福) ; Yuan M; Xue YF(薛艳芳); Wei JJ(魏进家)
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| Source Publication | Microgravity Science and Technology
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| 2009 | |
| Volume | 21Issue:S1Pages:S159-S173 |
| ISSN | 0938-0108 |
| Abstract | For efficiently cooling electronic components with high heat flux, experiments were conducted to study the flow boiling heat transfer performance of FC-72 over square silicon chips with the dimensions of 10 × 10 × 0.5 mm3. Four kinds of micro-pin-fins with the dimensions of 30 × 60, 30 × 120, 50 × 60, 50 × 120 μm2 (thickness, t × height, h) were fabricated on the chip surfaces by the dry etching technique for enhancing boiling heat transfer. A smooth surface was also tested for comparison. The experiments were made at three different fluid velocities (0.5, 1 and 2 m/s) and three different liquid subcoolings (15, 25 and 35 K). The results were compared with the previous published data of pool boiling. All micro-pin-fined surfaces show a considerable heat transfer enhancement compared with a smooth surface. Flow boiling can remarkably decrease wall superheat compared with pool boiling. At the velocities lower than 1 m/s, the micro-pin-finned surfaces show a sharp increase in heat flux with increasing wall superheat. For all surfaces, the maximum allowable heat flux, qmax, for the normal operation of LSI chips increases with fluid velocity and subcooling. For all micro-pin-finned surfaces, the wall temperature at the critical heat flux (CHF) is less than the upper limit for the reliable operation of LSI chips, 85◦C. The largest value of qmax can reach nearly 148 W/cm2 for micro-pin-finned chips with the fin height of 120 μm at the fluid velocity of 2 m/s and the liquid subcooling of 35 K. The perspectives for the boiling heat transfer experiment of the prospective micro-pin-finned sur- faces, which has been planned to be made in the Drop Tower Beijing/NMLC in the future, are also presented. |
| Subject Area | 微重力流体力学 |
| DOI | 10.1007/s12217-009-9137-5 |
| Indexed By | SCI |
| Language | 英语 |
| WOS ID | WOS:000268745900022 |
| WOS Keyword | SILICON CHIPS ; FC-72 ; ARRAYS |
| WOS Research Area | Engineering ; Thermodynamics ; Mechanics |
| WOS Subject | Engineering, Aerospace ; Thermodynamics ; Mechanics |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/28765 |
| Collection | 微重力重点实验室 |
| Corresponding Author | Wei JJ(魏进家) |
| Recommended Citation GB/T 7714 | Wei JJ,Zhao JF,Yuan M,et al. Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling[J]. Microgravity Science and Technology,2009,21,S1,:S159-S173. |
| APA | Wei JJ,赵建福,Yuan M,Xue YF,&魏进家.(2009).Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling.Microgravity Science and Technology,21(S1),S159-S173. |
| MLA | Wei JJ,et al."Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling".Microgravity Science and Technology 21.S1(2009):S159-S173. |
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