Knowledge Management System of Institue of Mechanics, CAS
| Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al | |
Chen SD; Ke FJ(柯孚久) ; Zhou M; Bai YL(白以龙); Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China.
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| Source Publication | Acta Materialia
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| 2007 | |
| Volume | 55Issue:9Pages:3169-3175 |
| ISSN | 1359-6454 |
| Abstract | Molecular dynamics (MD) simulations are carried out to analyze the diffusion bonding at Cu/Al interfaces. The results indicate that the thickness of the interfacial layer is temperature-dependent, with higher temperatures yielding larger thicknesses. At temperatures below 750 K, the interface thickness is found to increase in a stepwise manner as a function of time. At temperatures above 750 K, the thickness increases rapidly and smoothly. When surface roughness is present, the bonding process consists of three stages. In the first stage, surfaces deform under stress, resulting in increased contact areas. The second stage involves significant plastic deformation at the interface as temperature increases, resulting in the disappearance of interstices and full contact of the surface pair. The last stage entails the diffusion of atoms under constant temperature. The bonded specimens show tensile strengths reaching 88% of the ideal Cu/Al contact strength. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| Keyword | Diffusion Bonding Molecular Dynamics Temperature Effect Tensile Strength Molecular-dynamics Simulation Embedded-atom-method Theoretical-model Interface Alloys Copper Metals Ni |
| DOI | 10.1016/j.actamat.2006.12.040 |
| Indexed By | SCI ; EI |
| Language | 英语 |
| WOS ID | WOS:000246653000025 |
| WOS Keyword | MOLECULAR-DYNAMICS SIMULATION ; EMBEDDED-ATOM-METHOD ; THEORETICAL-MODEL ; INTERFACE ; ALLOYS ; COPPER ; METALS ; NI |
| WOS Research Area | Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS Subject | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/33987 |
| Collection | 力学所知识产出(1956-2008) |
| Corresponding Author | Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China. |
| Recommended Citation GB/T 7714 | Chen SD,Ke FJ,Zhou M,et al. Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al[J]. Acta Materialia,2007,55,9,:3169-3175. |
| APA | Chen SD,柯孚久,Zhou M,白以龙,&Chen, SD .(2007).Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al.Acta Materialia,55(9),3169-3175. |
| MLA | Chen SD,et al."Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al".Acta Materialia 55.9(2007):3169-3175. |
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