IMECH-IR  > 力学所知识产出(1956-2008)
PEG化磷脂膜在蛋白质芯片表面修饰中的应用
张义浜; 陈艳艳; 靳刚
Source Publication材料工程
2008-10-20
Issue10Pages:208-210
Abstract用PEG化磷脂膜修饰蛋白质芯片的二氧化硅表面,通过调节PEG的含量,考察磷脂膜对蛋白非特异性吸附的抑制,以及对蛋白分子固定的影响。结果表明,经过PEG化磷脂膜修饰的二氧化硅表面,可以显著抑制蛋白的非特异性吸附,并通过功能化的PEG分子有效固定配基及其抗体。
Keyword磷脂膜 表面修饰 椭偏光学成像技术
Language中文
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/40078
Collection力学所知识产出(1956-2008)
Corresponding Author张义浜
Recommended Citation
GB/T 7714
张义浜,陈艳艳,靳刚. PEG化磷脂膜在蛋白质芯片表面修饰中的应用[J]. 材料工程,2008,10,:208-210.
APA 张义浜,陈艳艳,&靳刚.(2008).PEG化磷脂膜在蛋白质芯片表面修饰中的应用.材料工程(10),208-210.
MLA 张义浜,et al."PEG化磷脂膜在蛋白质芯片表面修饰中的应用".材料工程 .10(2008):208-210.
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