Mechanisms of anisotropic friction in nanotwinned Cu revealed by atomistic simulations | |
Zhang JJ; Hartmaier A; Wei YJ(魏宇杰)![]() | |
Source Publication | MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING
![]() |
2013-09 | |
Volume | 21Issue:6Pages:065001/1-065001/16 |
ISSN | 0965-0393 |
Abstract | The nature of nanocrystalline materials determines that their deformation at the grain level relies on the orientation of individual grains. In this work, we investigate the anisotropic response of nanotwinned Cu to frictional contacts during nanoscratching by means of molecular dynamics simulations. Nanotwinned Cu samples containing embedded twin boundaries parallel, inclined and perpendicular to scratching surfaces are adopted to address the effects of crystallographic orientation and inclination angle of aligned twin boundaries cutting the scratching surface. The transition in deformation mechanisms, the evolution of friction coefficients and the friction-induced microstructural changes are analyzed in detail and are related to the loading conditions and the twinned microstructures of the materials. Furthermore, the effect of twin spacing on the frictional behavior of Cu samples is studied. Our simulation results show that the crystallographic orientation strongly influences the frictional response in different ways for samples with different twin spacing, because the dominant deformation mode varies upon scratching regions of different orientations. A critical inclination angle of 26.6. gives the lowest yield strength and the highest friction coefficient, at which the plasticity is dominated by twin boundary migration and detwinning. It is demonstrated that the anisotropic frictional response of nanotwinned Cu originates from the heterogeneous localized deformation, which is strongly influenced by crystallographic orientation, twin boundary orientation and loading condition. |
Keyword | Anisotropy Deformation Friction Molecular Dynamics Anisotropic Frictional Response Crystallographic Orientations Deformation Mechanism Localized Deformations Microstructural Changes Twin-boundary Migrations Twin-boundary Orientation |
Subject Area | 损伤、破坏机理和微结构演化 |
URL | 查看原文 |
Indexed By | SCI ; EI |
Language | 英语 |
WOS ID | WOS:000323290600002 |
Funding Organization | ThyssenKrupp AG; Bayer MaterialScience AG; Salzgitter Mannesmann Forschung GmbH; Robert Bosch GmbH; Benteler Stahl/Rohr GmbH; Bayer Technology Services GmbH; state of North-Rhine Westphalia; European Commission in the framework of the European Regional Development Fund (ERDF); NSFC [51222504, 11021262]; National Excellent Doctoral Dissertation of PR China [201031]; China Postdoctoral Science Foundation [2012M511463]; Heilongjiang Postdoctoral Foundation of China [LBH-Z11143]; Chinese Academy of Sciences (Hundred Talent Programme) |
Department | LNM微结构计算力学(筹) |
Classification | 二类/Q2 |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/47455 |
Collection | 非线性力学国家重点实验室 |
Corresponding Author | Zhang, JJ (reprint author), Harbin Inst Technol, Ctr Precis Engn, POB 413, Harbin 150001, Peoples R China. |
Recommended Citation GB/T 7714 | Zhang JJ,Hartmaier A,Wei YJ,et al. Mechanisms of anisotropic friction in nanotwinned Cu revealed by atomistic simulations[J]. MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING,2013,21,6,:065001/1-065001/16. |
APA | Zhang JJ,Hartmaier A,魏宇杰,Yan YD,Sun T,&Zhang, JJ .(2013).Mechanisms of anisotropic friction in nanotwinned Cu revealed by atomistic simulations.MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING,21(6),065001/1-065001/16. |
MLA | Zhang JJ,et al."Mechanisms of anisotropic friction in nanotwinned Cu revealed by atomistic simulations".MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING 21.6(2013):065001/1-065001/16. |
Files in This Item: | Download All | |||||
File Name/Size | DocType | Version | Access | License | ||
IMCAS-J2013-239.pdf(3658KB) | 开放获取 | -- | View Download |
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment