| Film residual stress assessment method via temporarily thermal relaxation | |
Cheng XX(程欣欣) ; Wu CW(吴臣武)
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| Source Publication | Experimental and Applied Mechanics - Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics |
| 2013 | |
| Pages | 267-276 |
| Conference Name | 2012 Annual Conference on Experimental and Applied Mechanics |
| Conference Date | JUN 11-14, 2012 |
| Conference Place | Costa Mesa, CA, United states |
| Abstract | The concept of temporarily thermal relaxation is extended theoretically to assess the film residual stress. First, the contribution of the initial stress to the observable displacement field is separated with eliminating the thermal expansion effect of the material. Then, the residual stress is inversely derived through the displacement increment. Finally, finite element analysis was carried out to provide numerical description of the partial relieve of the residual stress. |
| Keyword | Film Residual Stress Assessment Temporarily Thermal Relaxation |
| Department | 先进制造工艺力学重点实验室 |
| ISBN | 978-1-4614-4225-7 |
| URL | 查看原文 |
| Indexed By | EI |
| Language | 英语 |
| Document Type | 会议论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/48265 |
| Collection | 先进制造工艺力学实验室 |
| Corresponding Author | Wu CW(吴臣武) |
| Recommended Citation GB/T 7714 | Cheng XX,Wu CW. Film residual stress assessment method via temporarily thermal relaxation[C]Experimental and Applied Mechanics - Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics,2013:267-276. |
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