IMECH-IR  > 非线性力学国家重点实验室
Multiple-scale interface fracture analysis for thin film/substrate system under temperature mismatch
Li MZ(李美之); Ma HS(马寒松); Liang LH(梁立红); Wei YG(魏悦广); Li MZ(李美之)
Source PublicationIUTAM Symposium on Surface Effects in the Mechanics of Nanomaterials and Heterostructures - Proceedings of the IUTAM Symposium held in Beijing, China, 8-12 August, 2010
2013
Pages137-146
Conference NameIUTAM Symposium on Surface Effects in the Mechanics of Nanomaterials and Heterostructures
Conference DateAUG 08-12, 2010
Conference PlaceBeijing, China
AbstractBased on the Wei-Xu model (Int J Plast, 21:2123, 2005), a multiple-scale interface fracture analysis for the thin film/substrate system under temperature mismatch is carried out. The thin film delamination process at the macroscopic scale is analyzed by using the strain gradient plasticity theory. The plastic shielding effects on the interface crack propagation are investigated for both the elastic film/plastic substrate and the plastic film/elastic substrate systems. On the other hand, by presenting a bridging model (equivalent interface K’-field) and by using the Rice-Thomson discrete dislocation model, the microscopic fracture process of the thin film/substrate system is analyzed, and the dislocation shielding effects on interface cracking at the microscale are investigated. The results show that the variation of interface fracture energy has an inverse size effect with respect to the dislocation-free zone size.
KeywordMultiple-scale Fracture Thin Film Temperature Mismatch Fracture Energy Discrete Dislocation
ISBN978-94-007-4910-8
URL查看原文
Language英语
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/48308
Collection非线性力学国家重点实验室
Corresponding AuthorLi MZ(李美之)
Recommended Citation
GB/T 7714
Li MZ,Ma HS,Liang LH,et al. Multiple-scale interface fracture analysis for thin film/substrate system under temperature mismatch[C]IUTAM Symposium on Surface Effects in the Mechanics of Nanomaterials and Heterostructures - Proceedings of the IUTAM Symposium held in Beijing, China, 8-12 August, 2010,2013:137-146.
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