Knowledge Management System of Institue of Mechanics, CAS
| Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package | |
Wu CML; Lai JKL; Wu YL(吴永礼) ; Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong.
| |
| Source Publication | COMPOSITE STRUCTURES
 |
| 1997 | |
| Volume | 38Issue:1-4Pages:525-530 |
| ISSN | 0263-8223 |
| Abstract | A tape automated bonded (TAB) package is basically a composite structure. A three-dimensional finite element fracture analysis was performed to evaluate the effects of cracks in a TAB package under thermal cycling conditions. The lead-tin solder in the outer lead bond as well as the copper beam lead were taken as elasto-plastic materials. Interface cracks between the copper beam lead and the solder were included in the analysis. It was found that the prescribed cracks created new sources of stress concentrations, which are fairly mild. This result showed that the configuration of the outer lead bonds in TAB packages is generally resilient to thermal cycling, even with the presence of defects such as cracks. (C) 1997 Elsevier Science Ltd. |
| DOI | 10.1016/S0263-8223(97)00088-3 |
| Indexed By | SCI |
| Language | 英语 |
| WOS ID | WOS:000071253500054 |
| WOS Keyword | INTERCONNECTIONS |
| WOS Research Area | Materials Science |
| WOS Subject | Materials Science, Composites |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/58495 |
| Collection | 力学所知识产出(1956-2008) |
| Corresponding Author | Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong. |
| Recommended Citation GB/T 7714 | Wu CML,Lai JKL,Wu YL,et al. Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package[J]. COMPOSITE STRUCTURES,1997,38,1-4,:525-530. |
| APA | Wu CML,Lai JKL,吴永礼,&Wu, CML .(1997).Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package.COMPOSITE STRUCTURES,38(1-4),525-530. |
| MLA | Wu CML,et al."Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package".COMPOSITE STRUCTURES 38.1-4(1997):525-530. |
| Files in This Item: | Download All | |||||
| File Name/Size | DocType | Version | Access | License | ||
| JourArSuppl2016-217.（591KB） | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Download | |
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment