Molecular dynamics simulation of the temperature effects on nanoindentation

IMECH-IR > 力学所知识产出(1956-2008)

	Molecular dynamics simulation of the temperature effects on nanoindentation
	Chen SD; Ke FJ(柯孚久); Bai YL(白以龙)
会议录名称	Multiscaling in Applied Science and Emerging Technology, Fundamentals and Applications in Mesomechanics: Proceedings of the Sixth International Conference for Mesomechanics
	2004
会议名称	Multiscaling in Applied Science and Emerging Technology; Fundamentals and Applications in Mesomechanics:Proceedings of the Sixth International Conference for Mesomechanics
会议日期	May 31, 2004 - June 4, 2004
会议地点	Patras, Greece
摘要	Three dimensional molecular dynamics (MD) simulation was performed to investigate the effect of temperature on nanoindentation. Results indicate that the hardness fluctuates with increasing penetration depth in the case of shallow nanoindentation. This implies that it is insufficient to represent the effect of temperature by the hardness only at specific depth, and a hardness-depth curve is needed. In order to get rid of the fluctuation caused by random thermal motion of atoms, integral hardness was used. It is found that the temperature effect on hardness can be clearly revealed by the integral hardness-depth curves. The hardness and Young's modulus decrease with increasing temperature. Such a softening behavior is similar to experiment results[23] and a MD numerical results[8], which gave the data at a single depth. In addition, W p/Wt, H/E, and hf/hmax at different temperature are also investigated. Results show that these ratios are not sensitive to temperature.
关键词	Integral Hardness Modulus Nanohardness Nanoindentation
ISBN号	960881040X
收录类别	EI
语种	英语
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/60273
专题	力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Chen SD,Ke FJ,Bai YL. Molecular dynamics simulation of the temperature effects on nanoindentation[C]Multiscaling in Applied Science and Emerging Technology, Fundamentals and Applications in Mesomechanics: Proceedings of the Sixth International Conference for Mesomechanics,2004.