Knowledge Management System of Institue of Mechanics, CAS
| Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems | |
Wei YG(魏悦广) ; Zhao HF; Shu SQ
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| Source Publication | 11th International Conference on Fracture 2005, ICF11 |
| 2005 | |
| Conference Name | 11th International Conference on Fracture 2005, ICF11 |
| Conference Date | March 20, 2005 - March 25, 2005 |
| Conference Place | Turin, Italy |
| Abstract | In this paper, both the cohesive zone/nonlinear bending model and the cohesive zone/plane strain elastic-plastic FE analysis model are adopted for analyzing the thin film nonlinear peeling process. Characteristics of the energy release rate are analyzed and presented. The analysis results based on both models are used to predict peeling experiment of copper thin film on the ceramic interface. Through prediction and analyses, one found that for the same experimental result, the effective simulations can be obtained based on both models, however, different material parameters are corresponded. It implies that two models are suitable for different scales. Combining the results based on both models, size effects of thin film delamination are characterized. |
| Keyword | Cohesive Zones Copper Thin Film Different Scale Elastic-plastic Fe Analysis Interfacial Fracture Material Parameter Multi Scale Analysis Prediction And Analysis Size Effects Substrate System Thin Film Delamination |
| Indexed By | EI |
| Language | 英语 |
| Document Type | 会议论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/60282 |
| Collection | 力学所知识产出(1956-2008) |
| Recommended Citation GB/T 7714 | Wei YG,Zhao HF,Shu SQ. Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems[C]11th International Conference on Fracture 2005, ICF11,2005. |
| Files in This Item: | Download All | |||||
| File Name/Size | DocType | Version | Access | License | ||
| CaEi045.pdf（165KB） | 会议论文 | 开放获取 | CC BY-NC-SA | View Download | ||
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