| Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate | |
Yin HB; Chen SH; Liang LH(梁立红) ; Peng ZL(彭志龙); Wei YG(魏悦广)
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| Source Publication | JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME (IF:2.772[JCR-2018],2.392[5-Year]) |
| 2018-09-01 | |
| Volume | 85Issue:9Pages:Ar-91004 |
| ISSN | 0021-8936 |
| Abstract | The whole peeling behavior of thin films on substrates attract lots of research interests due to the wide application of film-substrate systems, which was well modeled theoretically by introducing Lennard-Jones (L-J) potential to describe the interface in Peng and Chen (2015, Effect of Bending Stiffness on the Peeling Behavior of an Elastic Thin Film on a Rigid Substrate," Phys. Rev. E, 91(4), p. 042401). However, it is difficult for real applications because the parameters in the L-J potential are difficult to determine experimentally. In this paper, with the help of the peeling test and combining the constitutive relation of a cohesive zone model (CZM) with the L-J potential, we establish a new method to find the parameters in the L-J potential. The whole peeling process can then be analyzed quantitatively. Both the theoretical prediction and the experimental result agree well with each other. Finite element simulations of the whole peeling process are carried out subsequently. Quantitative agreements among the theoretical prediction, numerical calculation, and the experiment measurement further demonstrate the feasibility of the method. Effects of not only the interface strength but also the interface toughness on the whole peeling behavior are analyzed. It is found that the peeling force at a peeling angle of 90 deg during the steady-state stage is affected only by the interface toughness, while the peeling force before the steady-state stage would be influenced significantly by the interface toughness, interface strength, and bending stiffness of the film. All the present results should be helpful for deep understanding and theoretical prediction of the interface behavior of film-substrate systems in real applications. |
| Keyword | film-substrate system interface behavior peeling force cohesive zone model L-J potential |
| DOI | 10.1115/1.4040336 |
| URL | 查看原文 |
| Indexed By | SCI ; EI |
| Language | 英语 |
| WOS ID | WOS:000447286400004 |
| WOS Keyword | DUCTILE THIN-FILMS ; INTERFACE STRENGTH ; ADHESION ; MODELS ; SIMULATIONS ; PLASTICITY ; COATINGS ; BEHAVIOR ; SYSTEMS ; WORK |
| WOS Research Area | Mechanics |
| WOS Subject | Mechanics |
| Funding Organization | BIT Creative Research Plan ; National Natural Science Foundation of China [11672296, 11372318, 11532013] |
| Classification | 一类/力学重要期刊 |
| Ranking | 1 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/78131 |
| Collection | 非线性力学国家重点实验室 |
| Affiliation | 1.[Yin, H. B. 2.Liang, L. H.] Chinese Acad Sci, Inst Mech, LNM, Beijing 100190, Peoples R China 3.Liang, L. H.] Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China 4.[Chen, S. H. 5.Peng, Z. L.] Beijing Inst Technol, Inst Adv Struct Technol, Beijing 100081, Peoples R China 6.Peng, Z. L.] Beijing Inst Technol, Beijing Key Lab Lightweight Multifunct Composite, Beijing 100081, Peoples R China 7.[Wei, Y. G.] Peking Univ, Coll Engn, Beijing 100871, Peoples R China |
| Recommended Citation GB/T 7714 | Yin HB,Chen SH,Liang LH,et al. Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate[J]. JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,2018,85,9,:Ar-91004. |
| APA | Yin HB,Chen SH,梁立红,彭志龙,&魏悦广.(2018).Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate.JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,85(9),Ar-91004. |
| MLA | Yin HB,et al."Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate".JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME 85.9(2018):Ar-91004. |
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| File Name/Size | DocType | Version | Access | License | ||
| irJ2018059.pdf（4041KB） | 期刊论文 | 出版稿 | 开放获取 | CC BY-NC-SA | View Download | |
| IrJ2018353.pdf（4041KB） | 期刊论文 | 出版稿 | 开放获取 | CC BY-NC-SA | View Download | |
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