| Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics | |
| Hu, Zhongwei1,2; Chen, Yue1,2; Lai, Zhiyuan1,2; Yu, Yiqing2; Xu, Xipeng1,2; Peng Q(彭庆)4; Zhang, Long3 | |
| Corresponding Author | Yu, Yiqing([email protected]) |
| Source Publication | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
 |
| 2022-06-01 | |
| Volume | 304Pages:14 |
| ISSN | 0924-0136 |
| Abstract | Coupling of multiple abrasive grains is crucial for the efficiency in the grinding process and grinder design. Here the coupling effect in a double-grain model in vibration-assisted scratch of single-crystal silicon carbide (SiC) have been investigated using the molecular dynamics simulations for both simultaneous and sequential scratch processes. The coupling between the double abrasive grains affect the scratch force, stress, amorphous layer and surface morphology. The reduction ratios of tangential and normal force and the influenced material volume show that the critical distance for the inhibition of the coupling of vibration-assisted scratch is significantly greater than that in conventional scratch. The change of overlap ratio can reflect the change trend of the scratch force reduction ratio. In the vibration-assisted grinding, the increase of overlap ratio also intensifies the coupling of the abrasive grains, resulting in faster material removal, smaller scratch force and better surface finish. In-sights obtained through the molecular dynamics analysis in this work into the coupling effects of abrasive grains in the vibration-assisted grinding process is believed to be beneficial in the development of grinding wheels and the optimization of machining processes. |
| Keyword | Single-crystal silicon carbide Vibration-assisted scratch Double abrasive grains Molecular dynamics |
| DOI | 10.1016/j.jmatprotec.2022.117551 |
| Indexed By | SCI ; EI |
| Language | 英语 |
| WOS ID | WOS:000806885500002 |
| WOS Keyword | MATERIAL REMOVAL MECHANISM ; SILICON-CARBIDE ; CRACK-PROPAGATION ; SUBSURFACE DAMAGE ; GLASS-CERAMICS ; SIMULATION ; INTERFERENCE ; BEHAVIOR ; TESTS ; MODEL |
| WOS Research Area | Engineering ; Materials Science |
| WOS Subject | Engineering, Industrial ; Engineering, Manufacturing ; Materials Science, Multidisciplinary |
| Funding Project | National Natural Science Foundation of China[52175404] ; National Natural Science Foundation of China[51835004] ; State Key Laboratory of Mechanical System and Vibration, China[MSV202112] ; LiYing Program of Institute of Mechanics, Chinese Academy of Sciences, China[E1Z1011001] |
| Funding Organization | National Natural Science Foundation of China ; State Key Laboratory of Mechanical System and Vibration, China ; LiYing Program of Institute of Mechanics, Chinese Academy of Sciences, China |
| Classification | 二类 |
| Ranking | 3+ |
| Contributor | Yu, Yiqing |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/89743 |
| Collection | 非线性力学国家重点实验室 |
| Affiliation | 1.Huaqiao Univ, Inst Mfg Engn, Xiamen 361021, Peoples R China; 2.Huaqiao Univ, Inst Mech Engn & Automat, Xiamen 361021, Peoples R China; 3.Shanghai Jiao Tong Univ, State Key Lab Mech Syst & Vibrat, Shanghai 200240, Peoples R China; 4.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China |
| Recommended Citation GB/T 7714 | Hu, Zhongwei,Chen, Yue,Lai, Zhiyuan,et al. Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics[J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2022,304:14.Rp_Au:Yu, Yiqing |
| APA | Hu, Zhongwei.,Chen, Yue.,Lai, Zhiyuan.,Yu, Yiqing.,Xu, Xipeng.,...&Zhang, Long.(2022).Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics.JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,304,14. |
| MLA | Hu, Zhongwei,et al."Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics".JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 304(2022):14. |
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| Jp2022FA315_2022_Cou（16353KB） | 期刊论文 | 出版稿 | 开放获取 | CC BY-NC-SA | View Download | |
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