| Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials | |
Wang, Shuai; Ma, Xiang; Gao, Quan; Wang, Jinyu; Xu, Na; Zhang, Yonghai; Wei, Jinjia; Zhao JF(赵建福) ; Li, Bin
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| Corresponding Author | Ma, Xiang([email protected]) ; Xu, Na([email protected]) |
| Source Publication | MICROGRAVITY SCIENCE AND TECHNOLOGY
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| 2023-11-17 | |
| Volume | 35Issue:6Pages:11 |
| ISSN | 0938-0108 |
| Abstract | An experimental investigation was conducted to prepare and study the thermal conductivity performance of copper and diamond composite materials. Copper powder and diamond particles were used as fillers, epoxy resin was used as matrix, and composite materials were prepared by vacuum-assisted mechanical stirring. The thermal expansion coefficient of different composite materials was measured by a laser flash method, which can be used to calculate the thermal conductivity. The effect of the filling rate of copper powder, the morphology of copper powder, the filling rate of diamond, and the thermal conductivity of the particles on the thermal conductivity of composite materials was studied. The results showed that thermal conductivity of copper powder and diamond particles composite materials were 874% and 535% higher than that of the epoxy resin when their filling rates were 50.3 vol.% and 40.0 vol.%, respectively. For two-dimensional flake copper powder materials, the thermal conductivity could be effectively improved at a lower filling rate. However, the flake particles were easy to aggregate at a high filling rate, which maybe cause the composite materials to pulverize. |
| Keyword | Thermal interface material Thermal conductivity Copper powder Diamond particles Filling rate |
| DOI | 10.1007/s12217-023-10082-9 |
| Indexed By | SCI ; EI |
| Language | 英语 |
| WOS ID | WOS:001102521700001 |
| WOS Keyword | INTERFACE MATERIALS ; EPOXY |
| WOS Research Area | Engineering ; Thermodynamics ; Mechanics |
| WOS Subject | Engineering, Aerospace ; Thermodynamics ; Mechanics |
| Funding Project | National Natural Science Foundation of China[51976163] ; Open Project of the State Key Laboratory of Superabrasives[GXNGJSKL-2022-02] ; Fundamental Research Funds for the Central Universities[XTR052022011] ; Joint Funds of the National Natural Science Foundation of China[U2141218] ; Young Talent Support Plan of Xi'an Jiaotong University |
| Funding Organization | National Natural Science Foundation of China ; Open Project of the State Key Laboratory of Superabrasives ; Fundamental Research Funds for the Central Universities ; Joint Funds of the National Natural Science Foundation of China ; Young Talent Support Plan of Xi'an Jiaotong University |
| Classification | 二类 |
| Ranking | 3+ |
| Contributor | Ma, Xiang ; Xu, Na |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/93362 |
| Collection | 微重力重点实验室 |
| Recommended Citation GB/T 7714 | Wang, Shuai,Ma, Xiang,Gao, Quan,et al. Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials[J]. MICROGRAVITY SCIENCE AND TECHNOLOGY,2023,35,6,:11.Rp_Au:Ma, Xiang, Xu, Na |
| APA | Wang, Shuai.,Ma, Xiang.,Gao, Quan.,Wang, Jinyu.,Xu, Na.,...&Li, Bin.(2023).Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials.MICROGRAVITY SCIENCE AND TECHNOLOGY,35(6),11. |
| MLA | Wang, Shuai,et al."Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials".MICROGRAVITY SCIENCE AND TECHNOLOGY 35.6(2023):11. |
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| Jp2023A097.pdf（3519KB） | 期刊论文 | 出版稿 | 开放获取 | CC BY-NC-SA | View Download | |
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