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| Thermoplastic polyimide with good comprehensive performance based on carbazole groups and short flexible linkages | |
| Du, QiYuan1; Chen, WeiPeng1; Guo, Hao1; Wang, Zhi1; Zhao, Li2; Zhu, Yongxiang3; Tan, WanYi1; Min, Yonggang1; Liu YD(刘屹东)4,5 | |
| Corresponding Author | Tan, Wan-Yi([email protected]) ; Min, Yonggang([email protected]) ; Liu, Yidong([email protected]) |
| Source Publication | JOURNAL OF POLYMER SCIENCE
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| 2024-05-08 | |
| Pages | 7 |
| ISSN | 2642-4150 |
| Abstract | Thermoplastic polyimides (TPIs) can meet the requirements of advanced electronic packaging such as flexible copper clad laminate (FCCL) applied under extreme conditions, attributed to their excellent thermal stability, mechanical properties, electrical insulation and chemical resistance. With the increasing demands for electronic devices, such as applications in high-frequency communication, it is highly desirable to develop high-performance TPI with good thermoplasticity, thermal stability, mechanical properties and dielectric properties. However, there is a trade-off between thermoplasticity and other properties. Herein, we introduce an effective strategy to afford TPIs with good performance by copolymerization of a diamine monomer consisted of a coplanar aromatic carbazole group and a short flexible linkage methylene group. On the one hand, short flexible linkages help improve the flexibility of polymer chains and are not too much to enable small-scale molecular motions below Tg. On the other hand, coplanar aromatic donor groups benefit to strong charge transfer complex (CTC) interaction and pi-pi stacking interaction. Based on this strategy, the resultant TPI possesses good thermoplasticity with a proper Tg of 348 degrees C. Meanwhile, it preserves a low coefficient thermal expansion of 48 ppm K-1, low dielectric constant/dielectric loss factor of 3.27/0.0073 at 10 GHz, and tensile strength of ca. 78 MPa. image |
| Keyword | coefficients of thermal expansion dielectric loss high-frequency communication polyimide thermoplastic polyimide |
| DOI | 10.1002/pol.20240069 |
| Indexed By | SCI ; EI |
| Language | 英语 |
| WOS ID | WOS:001215316900001 |
| WOS Research Area | Polymer Science |
| WOS Subject | Polymer Science |
| Funding Project | Key-Area Research and Development Program of Guangdong Province ; National Natural Science Foundation of China[U20A20340] ; Foshan Introducing Innovative and Entrepreneurial Teams[1920001000108] ; Guangzhou Hongmian Project[HMJH-2020-0012] ; High-level Innovation Research Institute Program of Guangdong Province[2020B0909010003/GARA2023001000] ; [2020B010182001] |
| Funding Organization | Key-Area Research and Development Program of Guangdong Province ; National Natural Science Foundation of China ; Foshan Introducing Innovative and Entrepreneurial Teams ; Guangzhou Hongmian Project ; High-level Innovation Research Institute Program of Guangdong Province |
| Classification | 二类 |
| Ranking | 1 |
| Contributor | Tan, Wan-Yi ; Min, Yonggang ; Liu, Yidong |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/95080 |
| Collection | 宽域飞行工程科学与应用中心 |
| Affiliation | 1.Guangdong Univ Technol GDUT, Sch Mat & Energy, Guangzhou 510640, Peoples R China; 2.Guangdong Polytech Water Resources & Elect Engn, Guangzhou, Peoples R China; 3.Guangdong Univ Technol GDUT, Sch Chem Engn & Light Ind, Guangzhou, Peoples R China; 4.Chinese Acad Sci, Inst Mech, Wide Range Flight Engn Sci & Applicat Ctr, Beijing 100190, Peoples R China; 5.Guangdong Aerosp Res Acad, Guangzhou, Nan Sha, Peoples R China |
| Recommended Citation GB/T 7714 | Du, QiYuan,Chen, WeiPeng,Guo, Hao,et al. Thermoplastic polyimide with good comprehensive performance based on carbazole groups and short flexible linkages[J]. JOURNAL OF POLYMER SCIENCE,2024:7.Rp_Au:Tan, Wan-Yi, Min, Yonggang, Liu, Yidong |
| APA | Du, QiYuan.,Chen, WeiPeng.,Guo, Hao.,Wang, Zhi.,Zhao, Li.,...&刘屹东.(2024).Thermoplastic polyimide with good comprehensive performance based on carbazole groups and short flexible linkages.JOURNAL OF POLYMER SCIENCE,7. |
| MLA | Du, QiYuan,et al."Thermoplastic polyimide with good comprehensive performance based on carbazole groups and short flexible linkages".JOURNAL OF POLYMER SCIENCE (2024):7. |
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