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Hybrid Surfaces with Capillary Wick and Minichannels for Enhancement of Phase-Change Immersion Cooling of Power Electronics
Chen, Hongqiang; Liu, Wanbo; Zhang, Yonghai; Wei, Jinjia; Du WF(杜王芳); Zhu ZQ(朱志强); Li, Bin; Wang, Shuai
通讯作者Zhang, Yonghai([email protected]) ; Zhu, Zhiqiang([email protected])
发表期刊MICROGRAVITY SCIENCE AND TECHNOLOGY
2024-05-09
卷号36期号:3页码:14
ISSN0938-0108
摘要The pool boiling heat transfer (phase-change immersion cooling) phenomenon holds significant importance in the energy consumption management of large-power electronics. However, the optimization of surface structure for achieving stable and efficient heat transfer during boiling process remains a significant challenge. Herein, we propose a simplified and direct hybrid surface strategy that combines crossed mini channels and a capillary wick to address the cooling issues faced by high-performance power devices. The copper capillary wick is combined with the crossed mini channel to form a hybrid surface by a simple integrated sintering method. This study investigates the combined effects of different parameters of the capillary wick (average diameter size and powder addition) and minichannels (depth and width) on enhancing the nucleate boiling performance on these hybrid surfaces. The working fluid used in this investigation is HFE-7100. At Delta Tsub = 30 K, the CHF achieved by the hybrid surfaces combining capillary wicks and minichannels can reach 131 W/cm2, while the highest HTC is measured at 2.32 W/(cm2K), both CHF and HTC achieve multiplicative enhancement compared to smooth surfaces. Furthermore, we have developed a CHF prediction model for the hybrid surfaces, which exhibits a prediction error of less than 15%.
关键词Pool boiling Heat transfer enhancement Capillary wick Minichannels
DOI10.1007/s12217-024-10117-9
收录类别SCI ; EI
语种英语
WOS记录号WOS:001251589500002
关键词[WOS]BOILING HEAT-TRANSFER ; FRICTIONAL PRESSURE-DROP ; PERFORMANCE ; GRAPHITE ; FC-72 ; TUBE
WOS研究方向Engineering ; Thermodynamics ; Mechanics
WOS类目Engineering, Aerospace ; Thermodynamics ; Mechanics
资助项目National Key R&D Program of China[2022YFF0503502] ; National Natural Science Foundation of China[51976163] ; Young Talent Support Plan of Xi'an Jiaotong University ; The Fundamental Research Funds for the Central Universities[XTR052022011] ; The Fundamental Research Funds for the Central Universities[XZY022023029] ; Key research and development program in Shaanxi Province of China[2021GXLH-Z-076] ; Joint Funds of the National Natural Science Foundation of China[U2141218] ; Second batch of scientific experiment proposals aboard China Space Station[TGMTYY00-JY-53-1.00] ; ESA-CMSA Joint Boiling Project[TGMTYY00-RW-05-1.00] ; Open Project of the State Key Laboratory of Superabrasives[GXNGJSKL-2022-02] ; Opening project of CAS Key Laboratory of Microgravity[NML202306]
项目资助者National Key R&D Program of China ; National Natural Science Foundation of China ; Young Talent Support Plan of Xi'an Jiaotong University ; The Fundamental Research Funds for the Central Universities ; Key research and development program in Shaanxi Province of China ; Joint Funds of the National Natural Science Foundation of China ; Second batch of scientific experiment proposals aboard China Space Station ; ESA-CMSA Joint Boiling Project ; Open Project of the State Key Laboratory of Superabrasives ; Opening project of CAS Key Laboratory of Microgravity
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文献类型期刊论文
条目标识符http://dspace.imech.ac.cn/handle/311007/95770
专题微重力重点实验室
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GB/T 7714
Chen, Hongqiang,Liu, Wanbo,Zhang, Yonghai,et al. Hybrid Surfaces with Capillary Wick and Minichannels for Enhancement of Phase-Change Immersion Cooling of Power Electronics[J]. MICROGRAVITY SCIENCE AND TECHNOLOGY,2024,36,3,:14.
APA Chen, Hongqiang.,Liu, Wanbo.,Zhang, Yonghai.,Wei, Jinjia.,杜王芳.,...&Wang, Shuai.(2024).Hybrid Surfaces with Capillary Wick and Minichannels for Enhancement of Phase-Change Immersion Cooling of Power Electronics.MICROGRAVITY SCIENCE AND TECHNOLOGY,36(3),14.
MLA Chen, Hongqiang,et al."Hybrid Surfaces with Capillary Wick and Minichannels for Enhancement of Phase-Change Immersion Cooling of Power Electronics".MICROGRAVITY SCIENCE AND TECHNOLOGY 36.3(2024):14.
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