IMECH-IR  > 非线性力学国家重点实验室
90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification
Long, Hao1; Liu, Yanwei1; Yin, Hanbin2,4,5; Zhang Y(张岩)3,6; Yang, Qingning1; Wei, Yueguang1
Corresponding AuthorWei, Yueguang([email protected])
Source PublicationJOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
2024-12-01
Volume193Pages:31
ISSN0022-5096
AbstractPeeling of thin films has been widely used in adhesion measurement, film transfer and bio-inspired design. Most previous studies focused on the peeling of thin films from rigid substrates, but soft substrates are common in practical applications. Herein, we propose a two-dimensional model based on the bilinear cohesive law to characterize the 90-degree peeling of elastic thin films from elastic soft substrates, and obtain theoretical solutions expressed in terms of the Chebyshev series. The theoretical solutions match well with the finite element method results, including the load-displacement curves and the bulging deformation of soft substrates. We find that with decreasing substrate modulus, the maximum peeling force (P-max) decreases but the steady-state peeling force remains unchanged. With the present solutions, the interfacial strength and fracture energy can be extracted simultaneously from the 90-degree peeling experiments of thin film/soft substrate systems, and then the experimentally measured P-max for different film thicknesses can be well predicted. Furthermore, we obtain a new power scaling law of P-max, where the scaling exponent depends on substrate elasticity. These results can help us measure the interfacial properties of thin film/soft substrate systems via peel tests, and regulate their peeling behaviors by interface design.
KeywordThin film Soft substrate Peeling Interface Cohesive zone model
DOI10.1016/j.jmps.2024.105855
Indexed BySCI ; EI
Language英语
WOS IDWOS:001315551200001
WOS KeywordADHESIVE THICKNESS ; FRACTURE ; DELAMINATION ; TAPE
WOS Research AreaMaterials Science ; Mechanics ; Physics
WOS SubjectMaterials Science, Multidisciplinary ; Mechanics ; Physics, Condensed Matter
Funding ProjectNational Natural Science Foundation of China[12032001] ; National Natural Science Foundation of China[12302090] ; National Natural Science Foundation of China[12202007] ; National Natural Science Foundation of China[12432003] ; China Postdoctoral Science Foundation[BX20230008] ; China Postdoctoral Science Foundation[BX20220008] ; China Postdoctoral Science Foundation[2023M733159] ; China Postdoctoral Science Foundation[2023M740089] ; National Science and Technology Major Project of China[J2022-V-0003-0029]
Funding OrganizationNational Natural Science Foundation of China ; China Postdoctoral Science Foundation ; National Science and Technology Major Project of China
Classification一类/力学重要期刊
Ranking3+
ContributorWei, Yueguang
Citation statistics
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/96585
Collection非线性力学国家重点实验室
Affiliation1.Peking Univ, Coll Engn, Dept Mech & Engn Sci, Beijing, Peoples R China;
2.Tsinghua Univ, Lab Flexible Elect Technol, Beijing, Peoples R China;
3.Chinese Acad Sci, Inst Mech, LNM, Beijing, Peoples R China;
4.Tsinghua Univ, Dept Engn Mech, Beijing, Peoples R China;
5.Inst Flexible Elect Technol THU, Jiaxing, Zhejiang, Peoples R China;
6.Univ Chinese Acad Sci, Sch Engn Sci, Beijing, Peoples R China
Recommended Citation
GB/T 7714
Long, Hao,Liu, Yanwei,Yin, Hanbin,et al. 90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification[J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,2024,193:31.Rp_Au:Wei, Yueguang
APA Long, Hao,Liu, Yanwei,Yin, Hanbin,张岩,Yang, Qingning,&Wei, Yueguang.(2024).90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification.JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,193,31.
MLA Long, Hao,et al."90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification".JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS 193(2024):31.
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