90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification | |
Long, Hao1; Liu, Yanwei1; Yin, Hanbin2,4,5; Zhang Y(张岩)3,6; Yang, Qingning1; Wei, Yueguang1![]() | |
Corresponding Author | Wei, Yueguang([email protected]) |
Source Publication | JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
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2024-12-01 | |
Volume | 193Pages:31 |
ISSN | 0022-5096 |
Abstract | Peeling of thin films has been widely used in adhesion measurement, film transfer and bio-inspired design. Most previous studies focused on the peeling of thin films from rigid substrates, but soft substrates are common in practical applications. Herein, we propose a two-dimensional model based on the bilinear cohesive law to characterize the 90-degree peeling of elastic thin films from elastic soft substrates, and obtain theoretical solutions expressed in terms of the Chebyshev series. The theoretical solutions match well with the finite element method results, including the load-displacement curves and the bulging deformation of soft substrates. We find that with decreasing substrate modulus, the maximum peeling force (P-max) decreases but the steady-state peeling force remains unchanged. With the present solutions, the interfacial strength and fracture energy can be extracted simultaneously from the 90-degree peeling experiments of thin film/soft substrate systems, and then the experimentally measured P-max for different film thicknesses can be well predicted. Furthermore, we obtain a new power scaling law of P-max, where the scaling exponent depends on substrate elasticity. These results can help us measure the interfacial properties of thin film/soft substrate systems via peel tests, and regulate their peeling behaviors by interface design. |
Keyword | Thin film Soft substrate Peeling Interface Cohesive zone model |
DOI | 10.1016/j.jmps.2024.105855 |
Indexed By | SCI ; EI |
Language | 英语 |
WOS ID | WOS:001315551200001 |
WOS Keyword | ADHESIVE THICKNESS ; FRACTURE ; DELAMINATION ; TAPE |
WOS Research Area | Materials Science ; Mechanics ; Physics |
WOS Subject | Materials Science, Multidisciplinary ; Mechanics ; Physics, Condensed Matter |
Funding Project | National Natural Science Foundation of China[12032001] ; National Natural Science Foundation of China[12302090] ; National Natural Science Foundation of China[12202007] ; National Natural Science Foundation of China[12432003] ; China Postdoctoral Science Foundation[BX20230008] ; China Postdoctoral Science Foundation[BX20220008] ; China Postdoctoral Science Foundation[2023M733159] ; China Postdoctoral Science Foundation[2023M740089] ; National Science and Technology Major Project of China[J2022-V-0003-0029] |
Funding Organization | National Natural Science Foundation of China ; China Postdoctoral Science Foundation ; National Science and Technology Major Project of China |
Classification | 一类/力学重要期刊 |
Ranking | 3+ |
Contributor | Wei, Yueguang |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/96585 |
Collection | 非线性力学国家重点实验室 |
Affiliation | 1.Peking Univ, Coll Engn, Dept Mech & Engn Sci, Beijing, Peoples R China; 2.Tsinghua Univ, Lab Flexible Elect Technol, Beijing, Peoples R China; 3.Chinese Acad Sci, Inst Mech, LNM, Beijing, Peoples R China; 4.Tsinghua Univ, Dept Engn Mech, Beijing, Peoples R China; 5.Inst Flexible Elect Technol THU, Jiaxing, Zhejiang, Peoples R China; 6.Univ Chinese Acad Sci, Sch Engn Sci, Beijing, Peoples R China |
Recommended Citation GB/T 7714 | Long, Hao,Liu, Yanwei,Yin, Hanbin,et al. 90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification[J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,2024,193:31.Rp_Au:Wei, Yueguang |
APA | Long, Hao,Liu, Yanwei,Yin, Hanbin,张岩,Yang, Qingning,&Wei, Yueguang.(2024).90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification.JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,193,31. |
MLA | Long, Hao,et al."90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification".JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS 193(2024):31. |
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