Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials | |
An, Dongqi1,2; Gong, Guangping1; Xu, Dian1,3; Zhou ZX(周赞鑫)4,5; Li, Rui1; Su YW(苏业旺)4,5 | |
通讯作者 | Li, Rui([email protected]) ; Su, Yewang([email protected]) |
发表期刊 | ADVANCED FUNCTIONAL MATERIALS
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2024-12-05 | |
页码 | 25 |
ISSN | 1616-301X |
摘要 | Metallic materials serving as indispensable conductors critically influence the performance of flexible electronics. Conventional structural designs have restricted metallic materials to exhibiting pure elastic deformation, but recent developments have emphasized an increased significance of plastic deformation, showing great potential for new breakthroughs in developing novel flexible electronics. This review first introduces the elastoplastic behavior of metallic materials, especially those capable of withstanding remarkable plastic deformation. The main design strategies toward flexible and stretchable electronics expanding elastic deformation range are then summarized, incorporating both strain alleviation and strain delocalization. Innovative studies exploiting plasticity for enhancing device performances or achieving shape-forming and reconfigurable electronics are further highlighted. Some perspectives on utilizing the elastoplastic behavior of metallic materials to innovate the next generation of flexible electronics are finally provided. |
关键词 | elastoplastic behavior flexible electronics metallic materials stretchable electronics |
DOI | 10.1002/adfm.202412796 |
收录类别 | SCI ; EI |
语种 | 英语 |
WOS记录号 | WOS:001370033600001 |
关键词[WOS] | STRAIN-RATE SENSITIVITY ; SERPENTINE MICROSTRUCTURES ; ELECTRICAL-CONDUCTIVITY ; RECOVERABLE PLASTICITY ; DUCTILITY ; STRENGTH ; DESIGN ; DEFORMATION ; FABRICATION ; MECHANICS |
WOS研究方向 | Chemistry ; Science & Technology - Other Topics ; Materials Science ; Physics |
WOS类目 | Chemistry, Multidisciplinary ; Chemistry, Physical ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
资助项目 | National Natural Science Foundation of China ; Key Research Program of Frontier Sciences of the Chinese Academy of Sciences[ZDBS-LY-JSC014] ; CAS Interdisciplinary Innovation Team[JCTD-2020-03] ; [12172359] ; [12022209] |
项目资助者 | National Natural Science Foundation of China ; Key Research Program of Frontier Sciences of the Chinese Academy of Sciences ; CAS Interdisciplinary Innovation Team |
论文分区 | 一类 |
力学所作者排名 | 1 |
RpAuthor | Li, Rui ; Su, Yewang |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://dspace.imech.ac.cn/handle/311007/97745 |
专题 | 非线性力学国家重点实验室 |
作者单位 | 1.Dalian Univ Technol, Sch Mech & Aerosp Engn, State Key Lab Struct Anal, Optimizat & CAE Software Ind Equipment, Dalian 116024, Peoples R China; 2.City Univ Hong Kong, Dept Architecture & Civil Engn, Hong Kong 999077, Peoples R China; 3.Nanyang Technol Univ, Coll Engn, Sch Mech & Aerosp Engn, Singapore 639798, Singapore; 4.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China; 5.Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China |
推荐引用方式 GB/T 7714 | An, Dongqi,Gong, Guangping,Xu, Dian,et al. Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials[J]. ADVANCED FUNCTIONAL MATERIALS,2024:25.Rp_Au:Li, Rui, Su, Yewang |
APA | An, Dongqi,Gong, Guangping,Xu, Dian,周赞鑫,Li, Rui,&苏业旺.(2024).Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials.ADVANCED FUNCTIONAL MATERIALS,25. |
MLA | An, Dongqi,et al."Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials".ADVANCED FUNCTIONAL MATERIALS (2024):25. |
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