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Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials
An, Dongqi1,2; Gong, Guangping1; Xu, Dian1,3; Zhou ZX(周赞鑫)4,5; Li, Rui1; Su YW(苏业旺)4,5
通讯作者Li, Rui([email protected]) ; Su, Yewang([email protected])
发表期刊ADVANCED FUNCTIONAL MATERIALS
2024-12-05
页码25
ISSN1616-301X
摘要Metallic materials serving as indispensable conductors critically influence the performance of flexible electronics. Conventional structural designs have restricted metallic materials to exhibiting pure elastic deformation, but recent developments have emphasized an increased significance of plastic deformation, showing great potential for new breakthroughs in developing novel flexible electronics. This review first introduces the elastoplastic behavior of metallic materials, especially those capable of withstanding remarkable plastic deformation. The main design strategies toward flexible and stretchable electronics expanding elastic deformation range are then summarized, incorporating both strain alleviation and strain delocalization. Innovative studies exploiting plasticity for enhancing device performances or achieving shape-forming and reconfigurable electronics are further highlighted. Some perspectives on utilizing the elastoplastic behavior of metallic materials to innovate the next generation of flexible electronics are finally provided.
关键词elastoplastic behavior flexible electronics metallic materials stretchable electronics
DOI10.1002/adfm.202412796
收录类别SCI ; EI
语种英语
WOS记录号WOS:001370033600001
关键词[WOS]STRAIN-RATE SENSITIVITY ; SERPENTINE MICROSTRUCTURES ; ELECTRICAL-CONDUCTIVITY ; RECOVERABLE PLASTICITY ; DUCTILITY ; STRENGTH ; DESIGN ; DEFORMATION ; FABRICATION ; MECHANICS
WOS研究方向Chemistry ; Science & Technology - Other Topics ; Materials Science ; Physics
WOS类目Chemistry, Multidisciplinary ; Chemistry, Physical ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
资助项目National Natural Science Foundation of China ; Key Research Program of Frontier Sciences of the Chinese Academy of Sciences[ZDBS-LY-JSC014] ; CAS Interdisciplinary Innovation Team[JCTD-2020-03] ; [12172359] ; [12022209]
项目资助者National Natural Science Foundation of China ; Key Research Program of Frontier Sciences of the Chinese Academy of Sciences ; CAS Interdisciplinary Innovation Team
论文分区一类
力学所作者排名1
RpAuthorLi, Rui ; Su, Yewang
引用统计
文献类型期刊论文
条目标识符http://dspace.imech.ac.cn/handle/311007/97745
专题非线性力学国家重点实验室
作者单位1.Dalian Univ Technol, Sch Mech & Aerosp Engn, State Key Lab Struct Anal, Optimizat & CAE Software Ind Equipment, Dalian 116024, Peoples R China;
2.City Univ Hong Kong, Dept Architecture & Civil Engn, Hong Kong 999077, Peoples R China;
3.Nanyang Technol Univ, Coll Engn, Sch Mech & Aerosp Engn, Singapore 639798, Singapore;
4.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China;
5.Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China
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GB/T 7714
An, Dongqi,Gong, Guangping,Xu, Dian,et al. Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials[J]. ADVANCED FUNCTIONAL MATERIALS,2024:25.Rp_Au:Li, Rui, Su, Yewang
APA An, Dongqi,Gong, Guangping,Xu, Dian,周赞鑫,Li, Rui,&苏业旺.(2024).Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials.ADVANCED FUNCTIONAL MATERIALS,25.
MLA An, Dongqi,et al."Embracing Plasticity: Unlocking the Full Potential of Flexible and Stretchable Electronics Through the Elastoplastic Behavior of Metallic Materials".ADVANCED FUNCTIONAL MATERIALS (2024):25.
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