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中国科学院力学研究所机构知识库
Knowledge Management System of Institue of Mechanics, CAS
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力学所知识产出(19... [1]
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刘胜 [1]
汪海英 [1]
白以龙 [1]
赵亚溥 [1]
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Journal ar... [1]
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2002 [1]
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中文 [1]
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机械强度 [1]
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新型可控坍塌芯片连接技术(C4)及芯下材料力学性能研究进展
期刊论文
机械强度, 2002, 卷号: 24, 期号: 3, 页码: 315-319
Authors:
汪海英
;
白以龙
;
赵亚溥
;
刘胜
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Submit date：2010/05/03
微电子封装
可控坍塌芯片连接技术
芯下材料
力学性能
可靠性
