Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer

IMECH-IR > 力学所知识产出(1956-2008)

	Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer
	Zhou Y; Yang CS; Chen JA; Ding GF,; Ding W; Wang L; Wang MJ; Zhang YM; 张泰华
发表期刊	Thin Solid Films
	2004
卷号	460 期号:1 页码:175-180
ISSN	0040-6090
学科领域	力学
DOI	10.1016/j.tsf.2004.01.088
收录类别	SCI
语种	英语
WOS记录号	WOS:000222217500025
WOS研究方向	Materials Science ; Physics
WOS类目	Materials Science, Multidisciplinary ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter
引用统计	被引频次：31[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/15573
专题	力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Zhou Y,Yang CS,Chen JA,等. Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer[J]. Thin Solid Films,2004,460,1,:175-180.
APA	Zhou Y.,Yang CS.,Chen JA.,Ding GF,.,Ding W.,...&张泰华.(2004).Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer.Thin Solid Films,460(1),175-180.
MLA	Zhou Y,et al."Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer".Thin Solid Films 460.1(2004):175-180.