IMECH-IR  > 力学所知识产出(1956-2008)
基体界面屈服强度和残余应力失配对界面裂纹扩展的影响
Alternative TitleEffect of mismatch of yielding strength and residual stresses along substrate interface on interfacial crack propagation
张国祥; 陈光南; 张坤; 罗耕星; 李怀学
Source Publication吉林大学学报. 工学版
2006
Volume36Issue:3Pages:294-297
ISSN1671-5497
Abstract对基体界面屈服强度和残余应力失配情况下的界面裂纹扩展机制进行了力学理论分析,并通过位错与裂纹的关系理论计算了界面裂纹尖端塑性区尺寸。结果表明:当界面裂纹由低强度区向高强度区扩展时,高强度区的残余压应力和屈服强度减少了裂纹尖端的塑性区长度和裂纹尖端张开位移,从而起到了抑制界面裂纹扩展的作用。
Keyword工程力学 界面裂纹 屈服强度 残余应力 失配 涂层/基体结构
Subject Area力学
Indexed ByEI ; CSCD
Language中文
CSCD IDCSCD:2446365
Citation statistics
Cited Times:1[CSCD]   [CSCD Record]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/17537
Collection力学所知识产出(1956-2008)
Recommended Citation
GB/T 7714
张国祥,陈光南,张坤,等. 基体界面屈服强度和残余应力失配对界面裂纹扩展的影响[J]. 吉林大学学报. 工学版,2006,36,3,:294-297.
APA 张国祥,陈光南,张坤,罗耕星,&李怀学.(2006).基体界面屈服强度和残余应力失配对界面裂纹扩展的影响.吉林大学学报. 工学版,36(3),294-297.
MLA 张国祥,et al."基体界面屈服强度和残余应力失配对界面裂纹扩展的影响".吉林大学学报. 工学版 36.3(2006):294-297.
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