Knowledge Management System of Institue of Mechanics, CAS
| Characterization of the Fracture Work for Ductile Film Undergoing the Micro-Scratch | |
Wei YG(魏悦广) ; Zhao MH(赵满洪); Tang S(唐山); Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
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| Source Publication | Acta Mechanica Sinica
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| 2002 | |
| Volume | 18Issue:5Pages:494-505 |
| ISSN | 0567-7718 |
| Abstract | The interface adhesion strength (or interface toughness) of a thin film/substrate system is often assessed by the micro-scratch test. For a brittle film material, the interface adhesion strength is easily obtained through measuring the scratch driving forces. However, to measure the interface adhesion strength (or interface toughness) for a metal thin film material (the ductile material) by the microscratch test is very difficult, because intense plastic deformation is involved and the problem is a three-dimensional elastic-plastic one. In the present research, using a double-cohesive zone model, the failure characteristics of the thin film/substrate system can be described and further simulated. For a steady-state scratching process, a three-dimensional elastic-plastic finite element method based on the double cohesive zone model is developed and adopted, and the steady-state fracture work of the total system is calculated. The parameter relations between the horizontal driving forces (or energy release rate of the scratching process) and the separation strength of thin film/substrate interface, and the material shear strength, as well as the material parameters are developed. Furthermore, a scratch experiment for the Al/Si film/substrate system is carried out and the failure mechanisms are explored. Finally, the prediction results are applied to a scratch experiment for the Pt/NiO material system given in the literature. |
| Subject Area | 力学 |
| URL | 查看原文 |
| Indexed By | SCI ; EI ; CSCD |
| Language | 英语 |
| WOS ID | WOS:000179015400006 |
| WOS Keyword | STRAIN GRADIENT PLASTICITY ; CRACK-GROWTH ; ADHESION ; DELAMINATION ; MECHANICS ; CLEAVAGE ; STRENGTH ; SOLIDS ; MODEL ; FLOW |
| WOS Research Area | Engineering ; Mechanics |
| WOS Subject | Engineering, Mechanical ; Mechanics |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/17635 |
| Collection | 力学所知识产出(1956-2008) |
| Corresponding Author | Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China. |
| Recommended Citation GB/T 7714 | Wei YG,Zhao MH,Tang S,et al. Characterization of the Fracture Work for Ductile Film Undergoing the Micro-Scratch[J]. Acta Mechanica Sinica,2002,18,5,:494-505. |
| APA | Wei YG,Zhao MH,Tang S,&Wei, YG .(2002).Characterization of the Fracture Work for Ductile Film Undergoing the Micro-Scratch.Acta Mechanica Sinica,18(5),494-505. |
| MLA | Wei YG,et al."Characterization of the Fracture Work for Ductile Film Undergoing the Micro-Scratch".Acta Mechanica Sinica 18.5(2002):494-505. |
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