Knowledge Management System of Institue of Mechanics, CAS
| Influence of inertial and thermal effects on the dynamic growth of voids in porous ductile materials | |
Zheng J; Bai YL(白以龙) ; Wang ZP; ZHENG, J (reprint author), CHINESE ACAD SCI,INST MECH,BEIJING 100080,PEOPLES R CHINA.
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| Source Publication | Journal De Physique IV
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| 1994 | |
| Volume | 4Issue:C8Pages:765-770 |
| ISSN | 1155-4339 |
| Abstract | The influence of inertial, thermal and rate - sensitive effects on the void growth at high strain rate in a thermal - viscoplastic solid is investigated by means of a theoretical model presented in the present paper. Numerical analysis of the model suggests that inertial, thermal and rate - sensitive effects are three major factors which greatly influence the behavior of void growth in the high strain rate case. Comparison of the mathematical model proposed in the present work and Johnson's model shows that if the temperature - dependence is considered, material viscosity eta can take the experimentally measured values. |
| Keyword | Fracture |
| DOI | 10.1051/jp4:19948118 |
| Indexed By | SCI |
| Language | 英语 |
| WOS ID | WOS:A1994PZ05600119 |
| WOS Keyword | FRACTURE |
| WOS Research Area | Physics |
| WOS Subject | Physics, Multidisciplinary |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/39270 |
| Collection | 力学所知识产出(1956-2008) |
| Corresponding Author | ZHENG, J (reprint author), CHINESE ACAD SCI,INST MECH,BEIJING 100080,PEOPLES R CHINA. |
| Recommended Citation GB/T 7714 | Zheng J,Bai YL,Wang ZP,et al. Influence of inertial and thermal effects on the dynamic growth of voids in porous ductile materials[J]. Journal De Physique IV,1994,4,C8,:765-770. |
| APA | Zheng J,白以龙,Wang ZP,&ZHENG, J .(1994).Influence of inertial and thermal effects on the dynamic growth of voids in porous ductile materials.Journal De Physique IV,4(C8),765-770. |
| MLA | Zheng J,et al."Influence of inertial and thermal effects on the dynamic growth of voids in porous ductile materials".Journal De Physique IV 4.C8(1994):765-770. |
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