| A micromechanical model for deformation behavior of nanocrystalline copper | |
Lan JX(兰姣霞) ; Wu YZ(吴永中); Hong YS(洪友士); Lan JX
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| Source Publication | NEW MATERIALS AND ADVANCED MATERIALS |
| 2011 | |
| Pages | 772-777 |
| Conference Name | 2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010 |
| Conference Date | NOV 06-08, 2010 |
| Conference Place | Shenzhen, China |
| Abstract | Molecular dynamics simulations have show that nanocrystalline (NC) materials can be treated as composite materials consisting of two phases of grain and grain boundary. In this paper, the incremental stress-strain relation is derived based on deformation mechanism of NC materials and internal variable theory from micromechanics point of view. The developed model is exemplified by the pure copper subjected to uniaxial tension. Implicated iteration algorithm is then employed to obtain the stress-strain relation. Moreover, the effects of grain shape and statistical distribution of grain sizes are also discussed, and predicted results are compared with experimental values to verify the model. |
| Keyword | Algorithms Copper Deformation Grain Boundaries Grain Size And Shape Materials Micromechanics Molecular Dynamics Strain Energy Deformation Behavior Deformation Mechanism Developed Model Experimental Values Grain Shapes Grain Size Internal Variable Theory Iteration Algorithms Micromechanical Model Molecular Dynamics Simulations Nanocrystalline Copper Nanocrystallines Pure Copper Statistical Distribution Stress Strain Relation Uniaxial Tensions |
| WOS ID | WOS:000288114200146 |
| Department | LNM金属材料微结构与力学性能 |
| ISBN | 9780878492039 |
| URL | 查看原文 |
| Indexed By | CPCI-S ; EI |
| Language | 英语 |
| Citation statistics | |
| Document Type | 会议论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/46819 |
| Collection | 非线性力学国家重点实验室 |
| Corresponding Author | Lan JX |
| Recommended Citation GB/T 7714 | Lan JX,Wu YZ,Hong YS,et al. A micromechanical model for deformation behavior of nanocrystalline copper[C]NEW MATERIALS AND ADVANCED MATERIALS,2011:772-777. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| AMR.152-153.772.pdf（353KB） | 会议论文 | 开放获取 | CC BY-NC-SA | View Application Full Text | ||
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