Knowledge Management System of Institue of Mechanics, CAS
| Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages | |
Wang HY(汪海英); Wang JJ(王建军); Liu S; Zhao YP(赵亚溥)
| |
| Source Publication | Proceedings of the Fourth International Symposium on Electronic Packaging Technology |
| 2001 | |
| Pages | 394-398 |
| Conference Name | Fourth International Symposium on Electronic Packaging Technology |
| Conference Date | 2001-8-8 |
| Conference Place | 北京/Beijing, China |
| Abstract | A finite element framework is established with the consideration of complete and different incomplete filled flip-chip package models.A nonlinear finite element technique,in which the viscoplastic material properties(strain rate dependent) of solder balls and underfill are considered,is adapted t... |
| Keyword | Solder Underfill Filled 0 Outmost Substrate 0 Fatigue Package Understand Joints Thermal Lives 0 Silicon Reliability Range 0 Different Smaller Corners Studied Assumed Simulation |
| Department | LNM;Institute of Mechanics;Chinese Academy of Sciences;Department of Mechanical Engineering;Wayne State University;Detroit;MI48202;USA; |
| Language | 英语 |
| Document Type | 会议论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/48194 |
| Collection | 力学所知识产出(1956-2008) |
| Recommended Citation GB/T 7714 | Wang HY,Wang JJ,Liu S,et al. Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages[C]Proceedings of the Fourth International Symposium on Electronic Packaging Technology,2001:394-398. |
| Files in This Item: | Download All | |||||
| File Name/Size | DocType | Version | Access | License | ||
| IrCA543.pdf（691KB） | 开放获取 | -- | View Download | |||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment