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| Molecular Dynamics Simulation of Microcrack Healing in Copper | |
Li S ; Gao KW; Qiao LJ; Zhou FX(周富信); Chu WY; Qiao, LJ (reprint author), Univ Sci & Technol Beijing, Dept Mat Phys, Beijing 100083, Peoples R China.
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| Source Publication | COMPUTATIONAL MATERIALS SCIENCE
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| 2001 | |
| Volume | 20Issue:2Pages:143-150 |
| ISSN | 0927-0256 |
| Abstract | The molecular dynamics method is used to simulate microcrack healing during heating or/and under compressive stress. A center microcrack in Cu crystal could be sealed under a compressive stress or by heating. The role of compressive stress and heating in crack healing was additive. During microcrack healing, dislocation generation and motion occurred. If there were pre-existed dislocations around the microcrack, the critical temperature or compressive stress necessary for microcrack healing would decrease, and the higher the number of dislocations, the lower the critical temperature or compressive stress. The critical temperature necessary for microcrack healing depended upon the orientation of crack plane. For example, the critical temperature of the crack along (001) plane was the lowest, i.e., 770 K. (C) 2001 Elsevier Science B.V. All rights reserved. |
| Keyword | Microcrack Healing Molecular Dynamics Simulation Dislocation Cu |
| DOI | 10.1016/S0927-0256(00)00130-0 |
| Indexed By | SCI |
| Language | 英语 |
| WOS ID | WOS:000166878500001 |
| WOS Keyword | THIN-CRYSTALS ; CRACK-TIP ; NUCLEATION ; METALS |
| WOS Research Area | Materials Science |
| WOS Subject | Materials Science, Multidisciplinary |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/58487 |
| Collection | 力学所知识产出(1956-2008) |
| Corresponding Author | Qiao, LJ (reprint author), Univ Sci & Technol Beijing, Dept Mat Phys, Beijing 100083, Peoples R China. |
| Recommended Citation GB/T 7714 | Li S,Gao KW,Qiao LJ,et al. Molecular Dynamics Simulation of Microcrack Healing in Copper[J]. COMPUTATIONAL MATERIALS SCIENCE,2001,20,2,:143-150. |
| APA | Li S,Gao KW,Qiao LJ,周富信,Chu WY,&Qiao, LJ .(2001).Molecular Dynamics Simulation of Microcrack Healing in Copper.COMPUTATIONAL MATERIALS SCIENCE,20(2),143-150. |
| MLA | Li S,et al."Molecular Dynamics Simulation of Microcrack Healing in Copper".COMPUTATIONAL MATERIALS SCIENCE 20.2(2001):143-150. |
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| JourArSuppl2016-207.（1114KB） | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Download | |
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