| In-Plane Deformation Mechanics for Highly Stretchable Electronics |
| Su YW(苏业旺); Ping XC; Yu KJ; Lee JW; Fan JA; Wang B; Li M; Li R; Harburg DV; Huang YA; Yu CJ; Mao SM; Shim J; Yang QL; Lee PY; Armonas A; Choi KJ; Yang YC; Paik U; Chang T; Dawidczyk TJ; Huang YG; Wang SD; Rogers JA; Wang, SD (reprint author), Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61820 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61820 USA.
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| Source Publication | ADVANCED MATERIALS
(IF:25.809[JCR-2018],24.794[5-Year]) |
| 2017-02
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| Volume | 29Issue:8Pages:UNSP 1604989 |
| ISSN | 0935-9648
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| Abstract | Scissoring in thick bars suppresses buckling behavior in serpentine traces that have thicknesses greater than their widths, as detailed in a systematic set of analytical and experimental studies. Scissoring in thick copper traces enables elastic stretchability as large as approximate to 350%, corresponding to a sixfold improvement over previously reported values for thin geometries (approximate to 60%). |
| DOI | 10.1002/adma.201604989
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| URL | 查看原文
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| Indexed By | SCI
; EI
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| Language | 英语
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| WOS ID | WOS:000395187900019
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| WOS Keyword | Buckling Mechanics
; Scissoring
; Non-buckling
; Stretchable Electronics
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| WOS Research Area | Chemistry
; Science & Technology - Other Topics
; Materials Science
; Physics
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| WOS Subject | Chemistry, Multidisciplinary
; Chemistry, Physical
; Nanoscience & Nanotechnology
; Materials Science, Multidisciplinary
; Physics, Applied
; Physics, Condensed Matter
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| Funding Organization | Y.S. acknowledges the support from Chinese Academy of Sciences via the
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| Department | LNM柔性结构与先进材料力学
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| Classification | 一类
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| Ranking | 1
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| Citation statistics |
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| Document Type | 期刊论文
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| Identifier | http://dspace.imech.ac.cn/handle/311007/60114
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| Collection | 非线性力学国家重点实验室
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| Corresponding Author | Wang, SD (reprint author), Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61820 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61820 USA. |
Recommended Citation
GB/T 7714 |
Su YW,Ping XC,Yu KJ,et al. In-Plane Deformation Mechanics for Highly Stretchable Electronics[J]. ADVANCED MATERIALS,2017,29,8,:UNSP 1604989.
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| APA |
Su YW.,Ping XC.,Yu KJ.,Lee JW.,Fan JA.,...&Rogers, JA .(2017).In-Plane Deformation Mechanics for Highly Stretchable Electronics.ADVANCED MATERIALS,29(8),UNSP 1604989.
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| MLA |
Su YW,et al."In-Plane Deformation Mechanics for Highly Stretchable Electronics".ADVANCED MATERIALS 29.8(2017):UNSP 1604989.
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