| In-Plane Deformation Mechanics for Highly Stretchable Electronics | |
| Su YW(苏业旺); Ping XC; Yu KJ; Lee JW; Fan JA; Wang B; Li M; Li R; Harburg DV; Huang YA; Yu CJ; Mao SM; Shim J; Yang QL; Lee PY; Armonas A; Choi KJ; Yang YC; Paik U; Chang T; Dawidczyk TJ; Huang YG; Wang SD; Rogers JA; Wang, SD (reprint author), Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61820 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61820 USA. | |
| Source Publication | ADVANCED MATERIALS
 |
| 2017-02 | |
| Volume | 29Issue:8Pages:UNSP 1604989 |
| ISSN | 0935-9648 |
| Abstract | Scissoring in thick bars suppresses buckling behavior in serpentine traces that have thicknesses greater than their widths, as detailed in a systematic set of analytical and experimental studies. Scissoring in thick copper traces enables elastic stretchability as large as approximate to 350%, corresponding to a sixfold improvement over previously reported values for thin geometries (approximate to 60%). |
| DOI | 10.1002/adma.201604989 |
| URL | 查看原文 |
| Indexed By | SCI ; EI |
| Language | 英语 |
| WOS ID | WOS:000395187900019 |
| WOS Keyword | Buckling Mechanics ; Scissoring ; Non-buckling ; Stretchable Electronics |
| WOS Research Area | Chemistry ; Science & Technology - Other Topics ; Materials Science ; Physics |
| WOS Subject | Chemistry, Multidisciplinary ; Chemistry, Physical ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| Funding Organization | Y.S. acknowledges the support from Chinese Academy of Sciences via the |
| Department | LNM柔性结构与先进材料力学 |
| Classification | 一类 |
| Ranking | 1 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/60114 |
| Collection | 非线性力学国家重点实验室 |
| Corresponding Author | Wang, SD (reprint author), Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61820 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61820 USA. |
| Recommended Citation GB/T 7714 | Su YW,Ping XC,Yu KJ,et al. In-Plane Deformation Mechanics for Highly Stretchable Electronics[J]. ADVANCED MATERIALS,2017,29,8,:UNSP 1604989. |
| APA | Su YW.,Ping XC.,Yu KJ.,Lee JW.,Fan JA.,...&Rogers, JA .(2017).In-Plane Deformation Mechanics for Highly Stretchable Electronics.ADVANCED MATERIALS,29(8),UNSP 1604989. |
| MLA | Su YW,et al."In-Plane Deformation Mechanics for Highly Stretchable Electronics".ADVANCED MATERIALS 29.8(2017):UNSP 1604989. |
| Files in This Item: | Download All | |||||
| File Name/Size | DocType | Version | Access | License | ||
| IMCAS-J2017-002.pdf（2617KB） | 期刊论文 | 作者接受稿 | 开放获取 | CC BY-NC-SA | View Download | |
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