Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire

doi:10.1016/j.mssp.2022.106470

IMECH-IR > 非线性力学国家重点实验室

	Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire
	Chen Y 1,2; Hu ZW 1,2; Yu YQ 2; Lai ZY 1,2; Zhu JG 1,2; Xu XP 1,2; Peng Q(彭庆)3
通讯作者	Hu, Zhongwei([email protected]) ; Peng, Qing([email protected])
发表期刊	MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
	2022-05-01
卷号	142 页码:9
ISSN	1369-8001
摘要	Owing to outstanding mechanical, optical, thermal stability and chemical stability properties, sapphire has widespread use in semiconductors, aerospace and other fields. However, it is difficult to machine it efficiently and precisely because of its brittleness and hardness. In this work, the processing and mechanism of machining sapphire using ultrasonic vibration-assisted grinding technology have been investigated via experiment. The machining factors have been analyzed, including the condition of machined surface, specific grinding energy, force and force ratio. Referring to conventional grinding, the application of ultrasonic vibration reduces the force, force ratio, specific energy, and the reduction ratio is direction dependent. The effect on surface roughness and morphology is also anisotropic. Regarding the smoothness of the surface, the suitable directions were axial and tangential, while there was no noticeable improvement in the radial direction. Our results and insights could be beneficial for the precise machining of brittle materials and quality management.
关键词	Sapphire Ultrasonic vibration-assisted grinding Surface quality Grinding characteristics
DOI	10.1016/j.mssp.2022.106470
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000792236100004
关键词[WOS]	MATERIAL REMOVAL MECHANISM ; STRESS ; EUAG
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
资助项目	National Natural Science Foundation of China[52175404] ; Fujian Province Regional Development Project in 2019[2019H4014] ; State Key Laboratory of Mechanical System and Vibration[MSV202112] ; LiYing Program of the Institute of Mechanics, Chinese Academy of Sciences[E1Z1011001]
项目资助者	National Natural Science Foundation of China ; Fujian Province Regional Development Project in 2019 ; State Key Laboratory of Mechanical System and Vibration ; LiYing Program of the Institute of Mechanics, Chinese Academy of Sciences
论文分区	二类
力学所作者排名	1
RpAuthor	Hu, Zhongwei ; Peng, Qing
引用统计	被引频次：42[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/89343
专题	非线性力学国家重点实验室
作者单位	1.Huaqiao Univ, Inst Mfg Engn, Xiamen 361021, Fujian, Peoples R China; 2.Huaqiao Univ, Inst Mech Engn & Automat, Xiamen 361021, Fujian, Peoples R China; 3.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China
推荐引用方式 GB/T 7714	Chen Y,Hu ZW,Yu YQ,et al. Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire[J]. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,142:9.Rp_Au:Hu, Zhongwei, Peng, Qing
APA	Chen Y.,Hu ZW.,Yu YQ.,Lai ZY.,Zhu JG.,...&彭庆.(2022).Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire.MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,142,9.
MLA	Chen Y,et al."Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire".MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 142(2022):9.

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