| Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire | |
| Chen Y1,2; Hu ZW1,2; Yu YQ2; Lai ZY1,2; Zhu JG1,2; Xu XP1,2; Peng Q(彭庆)3 | |
| Corresponding Author | Hu, Zhongwei([email protected]) ; Peng, Qing([email protected]) |
| Source Publication | MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
 |
| 2022-05-01 | |
| Volume | 142Pages:9 |
| ISSN | 1369-8001 |
| Abstract | Owing to outstanding mechanical, optical, thermal stability and chemical stability properties, sapphire has widespread use in semiconductors, aerospace and other fields. However, it is difficult to machine it efficiently and precisely because of its brittleness and hardness. In this work, the processing and mechanism of machining sapphire using ultrasonic vibration-assisted grinding technology have been investigated via experiment. The machining factors have been analyzed, including the condition of machined surface, specific grinding energy, force and force ratio. Referring to conventional grinding, the application of ultrasonic vibration reduces the force, force ratio, specific energy, and the reduction ratio is direction dependent. The effect on surface roughness and morphology is also anisotropic. Regarding the smoothness of the surface, the suitable directions were axial and tangential, while there was no noticeable improvement in the radial direction. Our results and insights could be beneficial for the precise machining of brittle materials and quality management. |
| Keyword | Sapphire Ultrasonic vibration-assisted grinding Surface quality Grinding characteristics |
| DOI | 10.1016/j.mssp.2022.106470 |
| Indexed By | SCI ; EI |
| Language | 英语 |
| WOS ID | WOS:000792236100004 |
| WOS Keyword | MATERIAL REMOVAL MECHANISM ; STRESS ; EUAG |
| WOS Research Area | Engineering ; Materials Science ; Physics |
| WOS Subject | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| Funding Project | National Natural Science Foundation of China[52175404] ; Fujian Province Regional Development Project in 2019[2019H4014] ; State Key Laboratory of Mechanical System and Vibration[MSV202112] ; LiYing Program of the Institute of Mechanics, Chinese Academy of Sciences[E1Z1011001] |
| Funding Organization | National Natural Science Foundation of China ; Fujian Province Regional Development Project in 2019 ; State Key Laboratory of Mechanical System and Vibration ; LiYing Program of the Institute of Mechanics, Chinese Academy of Sciences |
| Classification | 二类 |
| Ranking | 1 |
| Contributor | Hu, Zhongwei ; Peng, Qing |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/89343 |
| Collection | 非线性力学国家重点实验室 |
| Affiliation | 1.Huaqiao Univ, Inst Mfg Engn, Xiamen 361021, Fujian, Peoples R China; 2.Huaqiao Univ, Inst Mech Engn & Automat, Xiamen 361021, Fujian, Peoples R China; 3.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China |
| Recommended Citation GB/T 7714 | Chen Y,Hu ZW,Yu YQ,et al. Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire[J]. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,142:9.Rp_Au:Hu, Zhongwei, Peng, Qing |
| APA | Chen Y.,Hu ZW.,Yu YQ.,Lai ZY.,Zhu JG.,...&彭庆.(2022).Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire.MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,142,9. |
| MLA | Chen Y,et al."Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire".MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 142(2022):9. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| Jp2022FA395_2022_Pro（8942KB） | 期刊论文 | 出版稿 | 开放获取 | CC BY-NC-SA | View Application Full Text | |
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