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Numerical study on impact resistance of novel multilevel bionic thin-walled structures 期刊论文
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, 卷号: 16, 页码: 1770-1780./通讯作者:Xu, Xianghong
Authors:  Wei ZQ(魏志全);  Xu XH(许向红)
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Bionic structure design  Thin-walled structure  Impact resistance  
Gradient design of bio-inspired nacre-like composites for improved impact resistance 期刊论文
COMPOSITES PART B-ENGINEERING, 2021, 卷号: 215, 页码: 11./通讯作者:Xu, Xianghong
Authors:  Wei ZQ(魏志全);  Xu XH(许向红)
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Nacre-like structure  Gradient design  Impact resistance  
仿生微结构设计及其抗冲击机理研究 学位论文
博士论文,北京: 中国科学院大学, 2021
Authors:  魏志全
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梯度结构  砖-泥结构  薄壁结构  仿生设计  抗冲击性能  
FEM simulation on impact resistance of surface gradient and periodic layered bionic composites 期刊论文
COMPOSITE STRUCTURES, 2020, 卷号: 247, 页码: 9./通讯作者:Xu, Xianghong
Authors:  Wei ZQ(魏志全);  Xu XH(许向红)
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Bio-inspired design  Surface gradient structure  Periodic layered structure  Impact resistance  
非接触式测量大变形材料应变的方法及装置 专利
发明授权.非接触式测量大变形材料应变的方法及装置, 授权公告号: CN109238160B, 申请日期: 2018-09-06, 授权公告日期: 2019-12-27
Inventors:  顾洋;  魏志全;  许向红
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Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74./通讯作者:Song, Ming
Authors:  Song M;  Wei ZQ(魏志全);  Wang BY;  Chen L;  Chen L;  Szpunar JA
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Through-silicon via  Cu protrusion  Annealing temperature  Electron backscatter diffraction  Finite element analysis  
梯度仿生复合材料的抗冲击性能研究 会议论文
2018年全国固体力学学术会议, 中国黑龙江哈尔滨, 2018年11月23日至25日
Authors:  魏志全;  许向红
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仿生设计  梯度结构  抗冲击性能  结构防护  数值模拟