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A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack 期刊论文
SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY, 2018, 卷号: 61, 期号: 6, 页码: 64611
Authors:  Yi DK(易大可);  Wang TC(王自强)
View  |  Adobe PDF(1561Kb)  |  Favorite  |  View/Download：488/165  |  Submit date：2018/10/30
three-dimensional fracture analysis  out-of-plane constraint  three-dimensional J-integral  
Analysis of micro-indentation problem of a soft film on a hard substrate 会议论文
International Conference on Heterogeneous Material Mechanics (ICHMM), Huangshan, PEOPLES R CHINA, JUN 03-08, 2008
Authors:  Yi DK;  Wang ZQ(王自强)
Adobe PDF(341Kb)  |  Favorite  |  View/Download：784/137  |  Submit date：2009/07/23
Strain Gradient Theory  Size Effect  Soft Film  Hard Substrate  Plasticity