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Comparison of Cu thin films deposited on Si substrates with different surfaces and temperatures 期刊论文
APPLIED SURFACE SCIENCE, 2013, 卷号: 276, 页码: 417-423
Authors:  Zhang J(张俊);  Liu C(刘崇);  Fan J(樊菁);  Zhang, J (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab High Temp Gas Dynam, Beijing 100190, Peoples R China.
Adobe PDF(3091Kb)  |  Favorite  |  View/Download：1001/284  |  Submit date：2013/06/27
Copper Thin Film  Deposition And Growth  Molecular Dynamics  Crystalline Structure And Orientation  
Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
View  |  Adobe PDF(165Kb)  |  Favorite  |  View/Download：204/83  |  Submit date：2017/06/01
Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination