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Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20./通讯作者：Wang, Zhen
Authors:  Zhang, Sinan;  Wang Z(王振);  Wang, Jie;  Duan GH(段桂花);  Li, Haixia
Adobe PDF(8729Kb)  |  Favorite  |  View/Download：416/145  |  Submit date：2022/08/22
Cu/SAC305/Cu solder joints  in situ tensile test  fracture analysis  X-ray mu-CT  FE simulation  
Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems 会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
Authors:  Wei YG(魏悦广);  Zhao HF;  Shu SQ
View  |  Adobe PDF(165Kb)  |  Favorite  |  View/Download：204/83  |  Submit date：2017/06/01
Cohesive Zones  Copper Thin Film  Different Scale  Elastic-plastic  Fe Analysis  Interfacial Fracture  Material Parameter  Multi Scale Analysis  Prediction And Analysis  Size Effects  Substrate System  Thin Film Delamination