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Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire 期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2022, 卷号: 142, 页码: 9./通讯作者：Hu, Zhongwei, Peng, Qing
Authors:  Chen Y;  Hu ZW;  Yu YQ;  Lai ZY;  Zhu JG;  Xu XP;  Peng Q(彭庆)
Adobe PDF(8942Kb)  |  Favorite  |  View/Download：391/135  |  Submit date：2022/07/18
Sapphire  Ultrasonic vibration-assisted grinding  Surface quality  Grinding characteristics  
Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon 期刊论文
Materials Science In Semiconductor Processing, 2007, 页码: 270-275
Authors:  Tang QH(汤奇恒);  Tang, QH (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China.
Adobe PDF(1138Kb)  |  Favorite  |  View/Download：873/264  |  Submit date：2009/08/03
Molecular Dynamics Simulation  Atomic Force Microscopy  Silicon  Dislocation  Pin Tool  Atomic-force Microscopy  Molecular-dynamics Simulation  Phase-transformations  Shuffle Dislocations  Nano-indentation  Monocrystals  Surface  Si  Deformation  Fracture