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General criteria of material instabilities 会议论文
23rd International Congress of Theoretical and Applied Mechanics, 中国北京/Beijing, China, 2012-08-19
Authors:  Ma W(马维)
View  |  Adobe PDF(158Kb)  |  Favorite  |  View/Download：360/85  |  Submit date：2014/04/02
Material  Criteria  General  Workhardening  General  Three  Instability  Loading  Estimate  Dimensional  Assumed  Well  Thermal  Detail  Derived  Analysis  Shear  Strain  Linear  Rates  
Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
Authors:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
Adobe PDF(691Kb)  |  Favorite  |  View/Download：401/95  |  Submit date：2014/02/14
Solder  Underfill  Filled  0  Outmost  Substrate  0  Fatigue  Package  Understand  Joints  Thermal  Lives  0  Silicon  Reliability  Range  0  Different  Smaller  Corners  Studied  Assumed  Simulation