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A micromechanical model for deformation behavior of nanocrystalline copper 会议论文
2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010, Shenzhen, China, NOV 06-08, 2010
Authors:  Lan JX(兰姣霞);  Wu YZ(吴永中);  Hong YS(洪友士);  Lan JX
View  |  Adobe PDF(353Kb)  |  Favorite  |  View/Download：631/156  |  Submit date：2013/02/26
Algorithms  Copper  Deformation  Grain Boundaries  Grain Size And Shape  Materials  Micromechanics  Molecular Dynamics  Strain Energy  Deformation Behavior  Deformation Mechanism  Developed Model  Experimental Values  Grain Shapes  Grain Size  Internal Variable Theory  Iteration Algorithms  Micromechanical Model  Molecular Dynamics Simulations  Nanocrystalline Copper  Nanocrystallines  Pure Copper  Statistical Distribution  Stress Strain Relation  Uniaxial Tensions