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| Numerical study on optimal fluid settling management under microgravity 会议论文
Asian Microgravity Pre-Symposium 9th China-Japan-Korea Workshop on Microgravity Sciences, 中国广西桂林/Guilin, China, 2012-10-29
Authors: Zhou BH(周炳红); Wu CJ; Yu Q(于强); Liu QS(刘秋生)
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Settling Microgravity Management Fluid Numerical Optimal Study Settled Studied Through Under First Phase Weight System Dragon Station International Orbit Extended |
| Evaporating-freezing phenomena of water droplets during quick depressurization 会议论文
23rd International Congress of Theoretical and Applied Mechanics, 中国北京/Beijing, China, 2012-08-19
Authors: Du WF(杜王芳); Zhao JF(赵建福); Kang Q(康琦)
View | Adobe PDF(98Kb) | Favorite | View/Download：429/96 | Submit date：2014/04/02
Freezing Water Phenomena Quick Detail During Studied Equal Results Obtained Dynam Single Gases State Onset Solid |
| Short-term Microgravity Experiment of Pool Boiling Heat Transfer Utilizing the Drop Tower Beijing 会议论文
Asian Microgravity Pre-Symposium 9th China-Japan-Korea Workshop on Microgravity Sciences, 中国广西桂林/Guilin, China, 2012-10-29
Authors: Li J(李晶); Du WF(杜王芳); Xue YF(薛艳芳); Wei JJ(魏进家); Zhao JF(赵建福)
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Transfer Short Boiling Beijing Steady Short Silicon Heating State Thermal Gravity Obtained Influence Release Highly Transfer Studied Illusive Clearly Dissolved |
| Instabilities in a horizontal liquid layer in co-current gas flow with an evaporating interface 会议论文
Asian Microgravity Pre-Symposium 9th China-Japan-Korea Workshop on Microgravity Sciences, 中国广西桂林/Guilin, China, 2012-10-29
Authors: Liu R(刘荣); Liu QS(刘秋生); Kabov OA
View | Adobe PDF(50Kb) | Favorite | View/Download：475/159 | Submit date：2014/04/02
Evaporating Liquid Interface Horizontal Layer Current Streamwise Rigid Stability Studied Buoyancy Gradient Driven Chebyshev Occur Bounded Walls System Phase Shear |
| Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
Authors: Wang HY(汪海英); Wang JJ(王建军); Liu S; Zhao YP(赵亚溥)
Adobe PDF(691Kb) | Favorite | View/Download：401/95 | Submit date：2014/02/14
Solder Underfill Filled 0 Outmost Substrate 0 Fatigue Package Understand Joints Thermal Lives 0 Silicon Reliability Range 0 Different Smaller Corners Studied Assumed Simulation |
