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Wind velocity distribution reconstruction using CFD database with Tucker decomposition and sensor measurement 期刊论文
ENERGY, 2019, 卷号: 167, 页码: 1236-1250./通讯作者：Qin, L, Liu, S
Authors:  Qin L;  Liu S;  Kang Y;  Yan SA;  Schlaberg HI;  Wang Z(王展)
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Wind velocity distribution  Third-order CFD database  Tucker decomposition  Sensor measurement  
High strain-rate behavior and deformation mechanism of a multi-layer composite textured AZ31B Mg alloy plate 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 749, 页码: 23-39
Authors:  Zhang WG;  Liu S;  Li K;  Li PJ;  Qi JF;  Wang Z;  Chen Y;  Zhang HS(张虎生);  Meng L
View  |  Adobe PDF(9648Kb)  |  Favorite  |  View/Download：347/117  |  Submit date：2018/07/17
Az31 b Mg Alloy  Multi-layer Composite Textures  High Strain Rate  Twinning And Slip  Energy Absorption Capacity  
Measurement of Microscopic Deformation in a Cualni Single Crystal Alloy by Nanoindentation with a Heating Stage 期刊论文
Materials & Design, 2005, 卷号: 26, 期号: 5, 页码: 465-468
Authors:  Liu S(刘晟);  Zhao YP(赵亚溥);  Yu TX(余同希);  Zhao, YP (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China.
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On the Bearing Capacity of Suction Bucket Foundation in Saturated Sand 期刊论文
International Journal of Offshore and Polar Engineering, 2005, 卷号: 15, 期号: 4, 页码: 300-303
Authors:  Lu XB(鲁晓兵);  Liu S(刘晟);  Wang YH(王义华);  Wang SY(王淑云);  Shi DM;  Lu, XB (reprint author), Chinese Acad Sci, Inst Mech, Beijing, Peoples R China.
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Characteristic of Microscopic Shape Memory Effect in a Cualni Alloy by Nanoindentation 期刊论文
Journal of Materials Science, 2005, 卷号: 40, 期号: 6, 页码: 1501-1504
Authors:  Liu S(刘晟);  Zhao YP(赵亚溥);  Sun QP;  Yu TX(余同希);  Cao ZX;  Liu, C (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, 15 Zhongguancun Rd, Beijing 100080, Peoples R China.
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吸力式桶型基础承载力模型试验 会议论文
2003年度海洋工程学术会议, 浙江宁波, 2003
Authors:  刘晟;  王淑云;  鲁晓兵;  吴应湘;  赵京;  王爱兰
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桶基在单、分层土下的承载特性试验研究 会议论文
2003年度海洋工程学术会议, 浙江宁波, 2003
Authors:  王义华;  鲁晓兵;  王淑云;  刘晟;  时钟民
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Effects of Underfill's Filling Situation on the Reliability of Flip-chip Packages 会议论文
Fourth International Symposium on Electronic Packaging Technology, 北京/Beijing, China, 2001-8-8
Authors:  Wang HY(汪海英);  Wang JJ(王建军);  Liu S;  Zhao YP(赵亚溥)
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